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+ IC Substrates ≥12 µm
+ HDI/Flex & RF ≥25 µm
+ QTA & Sampling ≥25µm
+ Solder Mask
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Laser Direct Imaging

Orbotech delivers a breakthrough range of LDI systems with its field-proven LSO (Large Scan Optics) Technology™ for the production of advanced HDI and high-yield packaging boards.  

  IC Substrates ≥12 µm  
  HDI/Flex & RF ≥25 µm  
  QTA & Sampling ≥25µm  
  Solder Mask  
Offering full compatibility with existing production processes, Orbotech’s systems are capable of imaging on any type of UV-sensitive media, including dry and liquid resists. They also feature dual resolution capabilities providing maximum flexibility for handling a wide range of jobs on the same system.
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LDI Resist Article
LDI Mass Production Article

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