YAVNE, ISRAEL - ORBOTECH LTD. (NASDAQ/GSM SYMBOL: ORBK) today announced that it has delivered its 500th Laser Direct Imaging (“LDI”) system, a Paragon™-Xpress model. This particular system was purchased by Austria Technologie & Systemtechnik Aktiengesellschaft (“AT&S”), a long-time global customer of Orbotech and existing user of several Paragon LDI machines, for placement at its Shanghai, China facility for high density interconnect (“HDI”) Microvia technology used in mobile devices.
Commenting on this purchase, Mr. Andreas Gerstenmayer, Chief Executive Officer of AT&S, said: “For manufacturers of the smallest electronic devices, economical use of space is increasingly becoming an absolute must. After extensive evaluation of available LDI solutions, our decision to select this additional Orbotech LDI inline system for complex HDI Microvia manufacturing was clear-cut. By using Orbotech LDI technology for mass production in our process we can ensure delivery to our customers of the most highly specialized HDI products that enable further device miniaturization while meeting the required time-to-market.”
Mr. Richard Klapholz, President of Orbotech’s PCB Division, added: “Although delivery of this 500th LDI system marks a symbolic note for Orbotech, we primarily see it a testament to the critical role that our constantly-evolving technology plays in the manufacture of latest cutting-edge PCBs, such as the HDI designs incorporating stacked vias and embedded components produced by AT&S. Orbotech LDI is now used in producing the vast majority of advanced PCBs worldwide; and we are gratified by the widespread and positive impact that this revolutionary technology, introduced by the Company over a decade ago, is continuing to have upon our customers and the PCB industry as a whole.”
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards and flat panel displays; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech’s highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company’s end-to-end portfolio of solutions for the benefit of customers the world over. For more information visit http://www.orbotech.com/.
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to its operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2010. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
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Company Contact: |
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Michelle Harnish |
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Marketing Communications Project Manager |
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Orbotech Ltd. |
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U.S. Tel: +1-603-289-7937 |
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michelle@orbotech.com
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