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| 24.5.07 |
Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, which includes Paragon™-8000 and Paragon™-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
'Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech's LDI and AOI technologies are essential elements in our strategy', said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. 'Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost-effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech's LDI are outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards', he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: 'We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand their use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.'
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com./
About Orbotech Ltd.
Orbotech (NASDAQ/NM SYMBOL: ORBK) is a world leader in providing yield-enhancing, production support solutions for specialized applications in the supply chain of the electronics industry, principally for printed circuit boards (PCBs) and flat panel displays (FPDs). The Company designs, develops, manufactures, markets and services automated optical inspection (AOI) systems for bare and assembled PCBs and for FPDs, and imaging solutions for PCB production. The Company's innovative AOI, imaging and computer-aided manufacturing (CAM) technologies enable customers to achieve the increased yields and throughput essential to remaining at the forefront of electronics production. Through its subsidiary, Orbograph Ltd., the Company also develops and markets automatic check reading software to banks and other financial institutions. Of Orbotech's employees, more than one quarter are scientists and engineers, who integrate their multi-disciplinary knowledge, talents and skills to develop and provide sophisticated solutions and technologies designed to meet customers' long-term needs. Orbotech maintains its headquarters and its primary research, development and manufacturing facilities in Israel, and more than 30 offices worldwide. The Company's extensive network of marketing, sales and customer support teams throughout North America, Europe, the Pacific Rim, China and Japan deliver its knowledge and expertise directly to customers the world over. For more information visit http://www.orbotech.com./
Except for historical information, the matters discussed in this press release are forward-looking statements that are subject to certain risks and uncertainties which could cause the actual results to differ materially from those projected, including industry trends, the timing and strength of product and service offerings, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis and other risks detailed from time to time in the Company's SEC reports. The Company assumes no obligation to update the information in this press release.
Contact:
Michelle Harnish
Marketing Communications Manager
Orbotech Inc.
(978) 901-5120
mailto:michelle@orbotech.com?Subject=Web site mail
http://www.orbotech.com/ |
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