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Printed Circuit Boards
Automated Optical Inspection
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Laser Direct Imaging
+ IC Substrates ≥12µm
+ HDI/Flex & RF ≥20µm
+ QTA & Sampling ≥25µm
Laser Plotting
Inkjet Legend Printers
UV Laser Drilling
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Laser Direct Imaging

Orbotech delivers a breakthrough range of LDI systems with its field-proven LSO (Large Scan Optics) Technology™ for the production of advanced HDI and high-yield packaging boards.  



IC Substrates ≥12µm HDI/Flex & RF ≥20µm
QTA & Sampling ≥25µm

Orbotech's comprehensive range of LDI systems are especially designed to handle the most challenging Flip-Chip, BGA/CSP and Modules manufacturing, offering a breakthrough in fine-line imaging.

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