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Printed Circuit Boards
Automated Optical Inspection
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Direct Imaging
+ IC Substrates ≥8µm
+ HDI/Flex & RF ≥15µm
+ QTA & Sampling ≥25µm
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Inkjet Legend Printers
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Direct Imaging

Orbotech delivers a breakthrough range of DI systems with its field-proven LSO (Large Scan Optics) Technology™ for the production of advanced HDI and high-yield packaging boards.  

IC Substrates ≥8µm HDI/Flex & RF ≥15µm
QTA & Sampling ≥25µm

Orbotech's comprehensive range of DI systems are especially designed to handle the most challenging Flip-Chip, BGA/CSP and Modules manufacturing, offering a breakthrough in fine-line imaging.

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