Using exceptional Multi-Path TechnologyTM Orbotech’s UV laser drilling system achieves high drilling speed of over 3500 vias per second without compromising on accuracy. Supporting drilling of through hole and blind vias, our UV laser drilling system enables drilling of micro vias down to 30µm through copper, epoxy resin, solder mask and polyimide. With built-in measurement tools the system conducts automatic optical tests and calibrations ensuring consistent, top performance drilling of vias.

 

Emerald™ 150 UV Laser Drilling