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Orbotech and the Institute of Microelectronics (IME) to develop advanced packaging solutions in Fan-Out Wafer Level Packaging Joint Lab

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Orbotech and the Institute of Microelectronics (IME) to develop advanced packaging solutions in Fan-Out Wafer Level Packaging Joint Lab

Orbotech’s partnership with IME includes the integration of Orbotech’s Emerald™ UV Laser Drilling solution into IME’s Development Line to develop Fan-Out Wafer Level Packaging (FOWLP) capabilities for next-generation consumer electronics,...

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