Solid State Technology: "Fan-Out Wafer Level Packaging - breakthrough advantages and surmountable challenges
August 17, 2016
David Butler, EVP and General Manager of SPTS Technologies discusses the breakthrough advantages and surmountable challenges of Fan-Out Wafer level packaging. SPTS's ability to create ever-smaller electronic devices that maintain or surpass the performance of their physically larger predecessors
Author: David Butler (EVP, SPTS Technologies)
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