Silicon Semiconductor: Plasma Dicing: Strength in Numbers
March 27, 2017
The demand for smaller electronic products including burgeoning loT applications hos led to new focus on die size and wafer singulation. Richard Bornett, Etch Product Manager at SPTS Technologies explains how the benefits of plasma dicing grow as die continue to shrink.
Full Article (p20): https://data.angel.digital/pdf/silicon_2017_Issue_I.pdf
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