• -
  • San Jose, California, USA
  • Doubletree by Hilton


SPTS are pleased to announce that we will be exhibiting at the 15th Annual International Wafer-Level Packaging Conference. 

IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

We invite you to visit us at Booth No.24 to learn more about our wafer processing technologies.

Don't miss David Butler, EVP and General Manager of SPTS, who will be presenting "Fan-out Wafer Processing in the High Density Packaging Era" in Session 4 (Tues 23rd Oct, 3:00-4:30pm)

For more information regarding the conference, click here.


Please provide your first name
Please provide your last name
Please provide a valid email address
Please provide your telephone number
Please provide your company name
Please provide a message
Please confirm that you have read and agree to the privacy policy

Privacy Policy