High Accuracy Laser Drilling of Via Holes offers High Quality, Cost Efficient Process Solution for CMOS Image Sensors

YAVNE, ISRAEL, November 28, 2016 | ORBOTECH LTD.(NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment enabling the transformation of the global electronics manufacturing industry, today announced that its Emerald™Laser Via Formation system has been acquired by Huatian Technology (Kunshan) Electronics Co., Ltd.(Huatian) for its via formation in 3D wafer-level packaging (WLP) applications. Huatian Technology, a subsidiary of the Chinese IC test and packaging services company, TianShui Huatian Technology Co., Ltd (TSHT), will use Orbotech’s Emerald system to achieve high-accuracy precision formation of <30µm holes through polyimide (PI) lined vias in 3D wafer-level packaging. Huatian selected Orbotech’s Emerald system to be its new process tool of record (PTOR), based on the product’s ability to enable Huatian to optimize production capabilities and reduce production costs.
Mr Aimo Xiao, CEO of Huatian stated, “Orbotech’s SPTS Technologies is a valued supplier and production partner of Huatian, and their PVD solutions continue to play a key role in the success of our CIS wafer-level packaging business. We believe that the Emerald system will enable us to explore new applications in this growing industry while remaining cost competitive with innovative solutions for our global customers.”
“This is a further example of Orbotech’s core technologies being leveraged for SPTS’ semiconductor customers. The demand for ever-smaller devices with more features and higher performance continues to drive the semiconductor industry to adopt innovative process solutions at a lower total cost of ownership,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “Huatian already employs our Sigma fxP PVD systems in their 300mm CIS (CMOS image sensor) packaging lines. The addition of the Emerald laser drilling system to their CIS packaging lines will enable Huatian to improve their capabilities for small pitch CIS packaging schemes with a more reliable, more accurate and more cost-efficient through-hole via processing.”
About Emerald™ series Laser Via Formation
Orbotech’s Emerald series Laser Via Formation systems simultaneously drill eight areas on a panel through patented Multi-Path Technology. High-power UV laser via formation achieves the best registration accuracy in the market. The Emerald series UV Laser Via Formation supports below 20 μm via drilling through ABF, polyimide, ceramic, resin, mold compounds, metal and solder resist substrates with no residue or damage to the bottom of the via, and no undercut.
About Huatian Technology (Kushan) Electronics Co., Ltd.
Established in June 2008, Huatian Technology (Kunshan) Electronics Co., Ltd. is a corporation specializing in advanced LSI (Large-Scale Integration) assembly and test. The first OSAT in the world to apply TSVs for CIS packaging in mass production, Huatian’s services including Image Sensor Chip & Module packaging and test, Fingerprint Sensor Chip  and Module packaging and test, WL-MEMS Sensor Chip packaging and test, Wafer Bumping, WL-CSP, Flip Chip, low cost solution to Fan-out, and 3D multi-chip stacked package development. Huatian Technology (Kunshan) Co., Ltd. is a wholly owned subsidiary of a TianShui Huatian Technology Co., Ltd (TSHT). For more information, visit http://www.htkjks.com/index.html.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. Orbotech is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), RF devices, power semiconductors, and other electronic components. Orbotech’s solutions include automated optical inspection and shaping, direct imaging, laser drilling, Inkjet printing, array test and repair, yield management, and etch and deposition wafer process solutions.
Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com and www.spts.com
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Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the so-called ‘Brexit’ process, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the final timing, outcome and impact of the criminal matter expected in mid- to-late 2016 and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean Matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2015, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
Rami Rozen
Director of Investor Relations
Tel: +972-8-942-3582
Tally Kaplan Porat
Director of Corporate Marketing
Tel: +972-8-942-3603