Orbotech Ultra Dimension™
Orbotech’s Ultra Dimension™ is a 4-in-1 AOI solution that is revolutionizing the AOI room workflow. Leveraging Orbotech’s unique Triple Vision Technology™ and Magic Technology™, the Ultra Dimension enables manufacturers of advanced PCBs to completely overhaul the flow of their AOI room and reduce their total cost of ownership (TCO) by up to 35%. With four leading systems - pattern inspection, laser via inspection, Remote Multi-Image Verification (RMIV) and 2D metrology - in one groundbreaking solution, the Ultra Dimension offers advanced electronics manufacturers a way to significantly improve their quality and yield and reduce their operational costs.
Key Benefits*
- Decrease manpower by up to 40%
- Increase throughput by up to15%
- Reduce floor space by up to 30%
- Reduce TCO (total cost of ownership) by up to 35%
* Based on a typical scenario
4-in-1 Benefits
Pattern inspection & laser via (LV) inspection
- Single scan for both pattern and laser via inspection
- Flexibility to inspect a variety of applications and materials in one scan
- Significant reduction in false alarms without having to use inspection masks
- Dedicated inspection channels for all stages of laser via production
Remote Multi-Image Verification (RMIV)
- Automated simultaneous ‘grabbing’ of defect multi-images
- Significantly shorter verification cycle time than existing solutions
- Major reduction in quantity of standard verification stations and operators
- Unique capability to measure both top and bottom conductor widths ensuring higher reliability and tight impedance control
- Significantly faster 2D measurement cycle time
- Traceability and data analysis enabled by digitalized process
Suitable for advanced PCB production including:
- SLP (substrate-like PCB)
- mSAP (modified semi-additive process)
- Advanced HDI
- Advanced Flex
- IC Substrates
