Primaxx® HF Vapor Release Etch

Dry HF vapor etch processing for removing sacrificial oxide layers 

SPTS offers the broadest range of dry HF vapor release products, from lab systems for research and development to multi-chambered cluster tools for high volume production. The industry leading Primaxx® HF vapor etch release technology is used to remove sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.

Our proprietary dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology.

Combining anhydrous HF vapor and alcohol vapor at reduced pressure and elevated temperature provides a wide, stable process window that can address different oxide compositions and thicknesses, while maintaining high selectivity to other common materials found in MEMS designs including exposed aluminum/alloy features such as mirrors and bondpads.

Primaxx® Monarch300

Primaxx® Monarch300

The Primaxx® Monarch300 is a fully integrated, automated VHF etch tool designed to perform selective MEMS etch release via a controlled...

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Primaxx® Monarch 25

Primaxx® Monarch 25

The Monarch25 is a 25-wafer batch process module designed for medium to high volume HF release etch production applications in either the...

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Primaxx® Monarch 3

Primaxx® Monarch 3

The Monarch 3 is a compact module includes a 3-wafer process chamber, and is designed for research laboratory and small volume production...

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Primaxx® uEtch

Primaxx® uEtch

SPTS's uEtch is a single-wafer system specifically designed for university and small research laboratories. Fully integrated,...

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