PECVD for MEMS

MEMS applications demand use a wide range of dielectric film types and requirements are becoming more stringent as MEMS devices become increasingly sophisticated. SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers.

Benefits of SPTS PECVD:

  • High deposition rate SiOx and SiN
  • TEOS for enhanced step coverage
  • Stress tuning by dual RF
  • Dense, low hydrogen SiN films offer lower wet etch rate

Related Product Information

PECVD Product Info  Low Temp PECVD Application Brief