Direct imaging

Decrease cost of ownership while maintaining optimal quality at high speeds

Orbotech’s direct imaging (DI) solutions enable PCB manufacturers to achieve better results with high throughput, high registration accuracy and high quality.

Our DI systems help decrease overall cost of ownership while maintaining optimal quality at high speeds. Orbotech DI systems, powered by MultiWave Laser Technology™, and based on Orbotech’s field-proven LSO Technology™ achieve enhanced Depth-of-Focus for superior results on panel topography changes, as well as best line uniformity.

IC SUBSTRATES ≥8ΜM

IC SUBSTRATES ≥8ΜM

생산 현장에서 검증된 오보텍의 LDI 시스템은FC-BGA, FC-CSP, BGA/CSP 및 모듈등 가장 까다로운 애플리케이션을 취급할...

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Advanced HDI & Flex: Nuvogo™ Fine series

Advanced HDI & Flex: Nuvogo™ Fine series

Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers....

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HDI/FLEX & RF ≥25ΜM

HDI/FLEX & RF ≥25ΜM

생산현장에서 검증된 오보텍의 Paragon 시스템은 Advanced HDI 및 Flex/Rigid Flex 기판의 대량생산을 위하여 새로운 차원의...

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MLB &  QTA: Nuvogo™  series

MLB & QTA: Nuvogo™ series

Nuvogo™ 780 and the large format Nuvogo™ 780XL are members of the Orbotech Nuvogo™ family of industry-leading direct imaging (DI) solutions....

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