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인쇄 회로 기판(25 micron까지)

  1. Home
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  3. 인쇄회로기판
  4. 자동광학검사(AOI)
  5. 인쇄 회로 기판(25 micron까지)
Fusion™ Series

Fusion™ Series

오보텍의 최신 AOI 혁신제품인 Fusion은 PCB...

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Discovery™ II series

Discovery™ II series

Moving the world’ s best- selling AOI series to the next...

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VeriSmart™/VeriSmart-A

VeriSmart™/VeriSmart-A

VeriSmart™/VeriSmart-A 오보텍의 불량검증 및 리페어 스테이션은 PCB 애플리케이션의 검증 공정을 개선하기 위해 최상의...

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인쇄회로기판

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      • 합작사
  • PCB
    • SOLUTIONS & TECHNOLOGIES
      • 다이렉스 이미징
        • IC 소자
        • 차세대 고밀도다층기판, 차세대 연성기판
        • 고밀도다층기판, 연성기판, 차세대 다층기판
        • 다층인쇄회로기판
        • QTA
        • 솔더마스크
        • DI for Touch
      • 자동광학검사(AOI)
        • IC Substrates (5 micron까지)
        • 인쇄 회로 기판(25 micron까지)
        • 측정
        • AOI for Touch Sensors
      • 자동 광학 쉐이핑
      • 잉크젯/적층 프린팅
      • UV 레이저드릴링
      • 레이저 플로팅
      • Orbotech 스마트 팩토리/인더스트리 4.0
      • CAM 소프트웨어 & 엔지니어링
        • 컴퓨터제조
        • 엔지니어링
  • FPD
    • SOLUTIONS & TECHNOLOGIES
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      • 수리
      • Process Information & Classification
  • SPTS
    • SOLUTIONS & TECHNOLOGIES
      • Plasma Etch
      • Plasma Dicing
      • HF 박리 식각
      • XeF2 Vapor Release Etch
      • Metal Deposition
      • Molecular Vapor Deposition (MVD®)
      • PECVD
      • Thermal Products
        • Vertical Batch Furnaces
        • APCVD
      • Inkjet Package Marking
      • Single Wafer Platforms
    • Applications
      • Advanced Packaging
      • MEMS
      • Power Devices
      • RF-IC
      • LED Manufacturing
      • Si-based Semiconductors
    • About SPTS
      • About SPTS
      • Corporate Responsibility
      • Awards
      • SPTS Careers
      • SPTS Contacts
      • Resource Library
        • Tech Insights
          • MEMS
            • 1000th DRIE module installed
            • AlN and its Uses in the Electronics Industry (Part I)
            • Claritas End-point for DRIE
            • Cost-Effective Low Stress SiN for MEMS
            • Etch and Deposition Processes for BioMEMS Manufacturing
            • Introduction to HF Vapor Etch
            • Low Temperature PECVD for MEMS
            • MEMS for Mobile Applications
            • MEMS Microphones
            • Morflex – Flexible Process Control for MEMS & TSV
            • MVD Anti-stiction Coating for MEMS
            • Plasma Dicing (Dice Before Grind)
            • Plasma Dicing (Dice After Grind)
            • Plasma Etch End-Point Control
            • Plasma Processes for VCSELs
            • Surface Smoothing Processes for High Performance AlN Piezoelectrics
            • Wafer Level Packaging of MEMS
            • Xenon Difluoride - Dry Vapor Etch for Releasing MEMS
          • Advanced Packaging
            • Fan-out Wafer Level Packaging
            • Blanket Silicon Etching
            • High Productivity PVD for UBM/RDL
            • Inkjet Printing for Package Marking
            • Inkjet Printing for Underfill Dam
            • Via Reveal Passivation
            • Via Reveal Processing
            • Morflex - Flexible Process Control for MEMS and TSV Etch
          • Power Device Manufacturing
            • SiC Etch for Power & RF Devices
            • 300mm PVD for Power Devices
          • RF-IC
        • Technology Papers
        • Presentations
        • R&D Projects
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