플라즈마 식각 Omega® 식각 시스템 SPTS는 MEMS, 고급 패키징, LED, 고속 RF IC 및 전력 반도체 산업 내의 광범위한 응용 분야를 위한 고급 식각 기술을...
Available on a range of wafer handling platforms, SPTS supplies semiconductor wafer processing systems for volume production, R&D or pilot production environments. Served markets include Advanced Packaging, MEMS, LEDs, Power Semiconductors, and High Speed RF-ICs.
Technologies and Process Solutions offered include:
- Plasma Etch
- Plasma Dicing
- HF Release Etch
- XeF2 Release Etch
- Metal Deposition (PVD)
- Molecular Vapor Deposition (MVD)
- Thermal products
- Additive printing solutions
Single Wafer Platforms
SPTS's ICP, DRIE, PECVD, PVD and MOCVD modules are available on 3 wafer handling platforms:
- fxP® - 100 to 300mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
- c2L® - 3" to 200mm wafer size. Supports Etch, PVD, PECVD, MOCVD and HF Release modules
- LPX - 3" to 200mm wafer size. Supports Etch & PECVD modules only