June 21, 2018

High-frequency 5G wireless infrastructure requires a new approach to PCB manufacturing

Writer: Benny Solomon, AOI and AOS Marketing Director, Orbotech

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May 09, 2018

Brainstorm: how are manufacturers preparing for 5G?

ECN Brainstorm featuring: Benny Solomon, AOI and AOS Marketing Director, Orbotech

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April 30, 2018

Creating Perfect Solutions as Basic Principle of Business

Published by NanoIndustry Magazine - an interview with SPTS's Franck Torres-Miguel, Regional Account Manager. 

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April 09, 2018

From math to marketing: Orbotech CMO’s worldview of the industry?

Interview with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan

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March 26, 2018

Automated 2D Metrology for Impedance Control.

Writer: Micha Perlman

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March 19, 2018

Getting to know you: Spotlight on AOS.

Interview with Eran Lazar, VP product, AOI & AOS, Orbotech

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February 28, 2018

Maximizing your uptime.

Writer: Ron Kupershtein

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October 23, 2017

mSAP: The New PCB Manufacturing Imperative for 5G Smartphones.

Published by: Electronic Design , Writer: Meny Gantz

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October 15, 2017

Flexible OLED displays drive market disruption, manufacturing innovation.

Published by: Evaluation Engineering , Writer: Shulik Leshem & Noam Cohen

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August 28, 2017

Foxconn Gen 10+ LCD Display Manufacturing Highlights Yield Management Challenges with Large-Screen TVs.

Published by: EBN , Writer: Shulik Leshem

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August 09, 2017

Autonomous Vehicles: Driving Innovation In PCB Manufacturing.

Published by: ECN , Writer: Shavi Spinzi

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July 17, 2017

Miniaturized PCBs at the Intersection of Form and Function.

Published by: Embedded.com , Writer: Gil Tidhar

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July 01, 2017

The Evolution of Industry 4.0, Through the Eyes of the PCB Manufacturer.

Published by: Evaluation Engineering , Writer: Shavi Spinzi

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July 05, 2017

Q&A with David Butler EVP and General Manager of SPTS Technologies Ltd., about his vision of the market and company’s solutions.

Published by: i-Micronews

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April 17, 2017

Struggle to Shrink System Size

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April 25, 2017

The Struggle to Shrink System Size: Innovative Technologies Driving the Next Generation of Mobile Devices.

Published By: Global SMT & Packaging , Writer: Hanoch Kopel

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March 27, 2017

Plasma Dicing: Strength in Numbers

Published by: Silicon Semiconductor, Writer: Richard Barnett

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March 23, 2017

The Near and Far Future for Orbotech and Inspection

Published by: I-Connect007 , Interview with Arik Gordon, President, PCB, Orbotech

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March 01, 2017

Flex circuits: Innovations and processes

Published by: EDN , Writer: Micha Perlman

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January 12, 2017

Flexible OLED Displays: Overcoming the Final Barriers to Mass Commercialization with High-Yield Manufacturing Processes

Published by: EBN , Writer: Shulik Leshem

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December 15,  2016

Q&A with Richard Barnett about SPTS's Plasma Dicing solutions, position in the industry and vision of the market

Published by: i-Micronews

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September 10,  2016

"Plasma Dicing - Benefits and Process Considerations"

Published by: TAP Times, Writer: Richard Barnett

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August 17, 2016

"Fan-Out Wafer Level Packaging - breakthrough advantages and surmountable challenges"

Published by: Solid State Technology, Writer: David Butler

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June 14, 2016

"Comparison between wet and dry silicon via reveal in 3D backside processing"

Published by: Chip Scale Review, Writer: Dave Thomas et al. (SPTS), Anne Jourdain et al. (imec)

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May 16, 2016

"Advances in Back-Side etching of SiC for GaN"

Published by: Solid State Technology, Writer: Anthony Barker

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April 18, 2016

Q&A with David Butler concerning the latest Advanced Packaging trends

Published by: i-Micronews, Writer: David Butler

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April 29, 2016

Fan-Out Wafer Level Packaging platform discussed with SPTS Technologies

Published by: i-Micronews , Writer: David Butler

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Cautionary Statement Regarding Forward-Looking Statements 

Except for historical information, the matters discussed in this post are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this post to reflect new information, future events or otherwise, except as required by law.