• -
  • Seoul, Korea
  • COEX

SPTS are pleased to announce that we will be attending the 17th international Symposium on Microelectronics and Packaging (ISMP 2018) which will be held at COEX convention center, Seoul, Korea, on October 24-26, 2018.

This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in electronic packaging process and materials.

Don't miss Dave Thomas, Senior Director - Etch Product Management, who will be presenting "I2-2 Blanket Silicon Etching for High Productivity Via Reveal andExtreme Thinning Processes for 2.5D and 3D Advanced Packaging" (Friday 26th  Oct, 10:25-10:45)

For more information regarding the conference, click here.

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