SPTS are proud to be presenting at the China MEMS Manufacturing Conference, in Hall A of the Suzhou International Expo Center, from 23 - 25 October 2019.
MEMS Manufacturing Technologies to Carry MEMS into the Future
Mr. David Springer, Product Manager - Release Etch Division
Leading MEMS manufacturers are changing the way they manufacture their products. This is in response to the market’s demands to shrink die and packages with ever increasing performance, lower power and increased reliability. From accelerometers to displays, for devices and how they are packaged, SPTS has been working with leading MEMS customers to meet these challenges. This talk will discuss three areas of change in MEMS manufacturing; releasing MEMS devices, protecting MEMS devices from failure after deployment, and improving package performance. It will cover a number of manufacturing technologies including highly selective, isotropic etching, and deposition of films for modifying surface energy as barrier layers on MEMS devices and MEMS packages.
For more information or to register, please click here.