Orbotech in the media

Summer School for Buyers: HDI & Auto Design

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  • Source: EBN

The shift from combustion engine-based cars with human drivers to semi-autonomous/ autonomous electronics-based cars presents clear design challenges. With automotive electronics projected to account for 35% of the total cost of the car by 2020, and 50% of the total cost by 2030, the physical footprint of the electronics will need to be significantly reduced in order to ensure the high functionality. Find out more about the central role that HDI can play in shrinking electronics.

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 Summer School for Buyers: HDI & Auto Design

Orbotech in the media

Brainstorm: What's the Next Big Advancement in Smart Home Tech?

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  • Source: ECNMAG

The introduction of 5G communications will advance capacity and connectivity far beyond current levels and is expected to drive new advances in smart appliances and smart home technology- read more here.

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Brainstorm: What's the Next Big Advancement in Smart Home Tech?

Orbotech in the media

Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

At the recent CPCA Show in Shanghai, Orbotech celebrated having over 100 of their Orbotech Diamond™ direct imaging (DI) machines in the marketplace. Barry Matties caught up with  Meny Gantz—VP of marketing for Orbotech’s PCB division—to talk about the drivers behind the success of Orbotech Diamond systems before turning the conversation toward the future and Industry 4.0. Orbotech’s large footprint comes with a massive amount of data collection as they now widen their focus to smart factory solutions and managing data to support their customers’ increasing demands.

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Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

Orbotech in the media

The Institute of Circuit Technology Annual Symposium 2018

Peter Alliston, VP sales for Orbotech West, discussed the trends currently driving PCB technology, and described how leading suppliers of imaging and inspection tools had responded with developments in the capability of their equipment. He identified four market sectors: Internet of Things and 5G infrastructure, smartphones, automotive, and Industry 4.0 and robotics.

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The Institute of Circuit Technology Annual Symposium 2018

Orbotech in the media

Brainstorm: How Are Manufacturers Preparing For 5G?

To effectively address the question of how manufacturers can prepare for the 5G wireless networking juggernaut, one can look ahead to the impact 5G will have on electronic end devices targeted to support 10X faster data rates and 1000X more data traffic. 5G will facilitate powerful connectivity throughout all industries, and manufacturing innovation must advance to support the scale and quality necessary for reliable implementation. The impact of 5G on PCB production provides a good specific illustration of the changes needed. To read more from Orbotech expert Benny Solomon on how manufacturers are preparing for 5G, click below.

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Brainstorm: How Are Manufacturers Preparing For 5G?

Orbotech in the media

Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.

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Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

Orbotech in the media

From Math to Marketing: Orbotech CMO’s Worldview of the Industry

Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI. Lior also offered his advice to board shops trying to survive in today’s market and how to deal with a new breed of customers.

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From Math to Marketing: Orbotech CMO’s Worldview of the Industry

Orbotech in the media

ECN 2018 Tech and Engineering Predictions Part 3

Each New Year invites a host of achievements, inventions, and technological advancements. As we enter the early months of another year, industry experts share their opinions on what's ahead for tech and engineering in 2018. Below you can read Orbotech's predictions by Tally Kaplan Porat, Director of Corporate Marketing.

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ECN 2018 Tech and Engineering Predictions Part 3

Orbotech in the media

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0. To read the whole interview click the button below.

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Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Orbotech in the media

Tools from software to X-ray systems round out PCB test and inspection

Printed-circuit-board quality challenges extend from design through production test and inspection and on to field diagnostics. Meny Gantz, VP of marketing for Orbotech’s PCB division, cited some key trends in the PCB arena. The increasing sophistication of smartphones, the proliferation of automotive electronics, the emergence of Industry 4.0, and the rollout of 5G are all leading to small-form-factor, high-density-interconnect (HDI) boards requiring fine traces with good impedance control, which in turn requires tighter control of conductor dimensions, he said.

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Tools from software to X-ray systems round out PCB test and inspection

Orbotech in the media

Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the value of PCB production in 2016 was US$ 58.2 billion, representing a 1.9% decline compared to the previous year. But 2017 has brought about a change as the industry faces both challenges and opportunities. The recently released iPhone 8 and iPhone X require high-end HDI (High Density Interconnect) PCBs using advanced technologies such as mSAP (modified semi-additive process), which is a substrate-like PCB (SLP) process

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Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

Orbotech in the media

£50m research centre with Bath Uni targets LEDs and radio technologies

A £50m project is aiming to be Europe’s leading centre for compound semiconductors such as gallium nitride and silicon carbide for LED, radio and power applications. The Compound Semiconductor Applications Catapult will be based in Newport, Wales, with support from the University of Bath. It is about to appoint a chief executive and create a technology campus.  

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£50m research centre with Bath Uni targets LEDs and radio technologies