Orbotech in the media

The Institute of Circuit Technology Annual Symposium 2018

Peter Alliston, VP sales for Orbotech West, discussed the trends currently driving PCB technology, and described how leading suppliers of imaging and inspection tools had responded with developments in the capability of their equipment. He identified four market sectors: Internet of Things and 5G infrastructure, smartphones, automotive, and Industry 4.0 and robotics.

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The Institute of Circuit Technology Annual Symposium 2018

Orbotech in the media

Brainstorm: How Are Manufacturers Preparing For 5G?

To effectively address the question of how manufacturers can prepare for the 5G wireless networking juggernaut, one can look ahead to the impact 5G will have on electronic end devices targeted to support 10X faster data rates and 1000X more data traffic. 5G will facilitate powerful connectivity throughout all industries, and manufacturing innovation must advance to support the scale and quality necessary for reliable implementation. The impact of 5G on PCB production provides a good specific illustration of the changes needed. To read more from Orbotech expert Benny Solomon on how manufacturers are preparing for 5G, click below.

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Brainstorm: How Are Manufacturers Preparing For 5G?

Orbotech in the media

Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.

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Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

Orbotech in the media

From Math to Marketing: Orbotech CMO’s Worldview of the Industry

Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI. Lior also offered his advice to board shops trying to survive in today’s market and how to deal with a new breed of customers.

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From Math to Marketing: Orbotech CMO’s Worldview of the Industry

Orbotech in the media

ECN 2018 Tech and Engineering Predictions Part 3

Each New Year invites a host of achievements, inventions, and technological advancements. As we enter the early months of another year, industry experts share their opinions on what's ahead for tech and engineering in 2018. Below you can read Orbotech's predictions by Tally Kaplan Porat, Director of Corporate Marketing.

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ECN 2018 Tech and Engineering Predictions Part 3

Orbotech in the media

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0. To read the whole interview click the button below.

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Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Orbotech in the media

Tools from software to X-ray systems round out PCB test and inspection

Printed-circuit-board quality challenges extend from design through production test and inspection and on to field diagnostics. Meny Gantz, VP of marketing for Orbotech’s PCB division, cited some key trends in the PCB arena. The increasing sophistication of smartphones, the proliferation of automotive electronics, the emergence of Industry 4.0, and the rollout of 5G are all leading to small-form-factor, high-density-interconnect (HDI) boards requiring fine traces with good impedance control, which in turn requires tighter control of conductor dimensions, he said.

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Tools from software to X-ray systems round out PCB test and inspection

Orbotech in the media

Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the value of PCB production in 2016 was US$ 58.2 billion, representing a 1.9% decline compared to the previous year. But 2017 has brought about a change as the industry faces both challenges and opportunities. The recently released iPhone 8 and iPhone X require high-end HDI (High Density Interconnect) PCBs using advanced technologies such as mSAP (modified semi-additive process), which is a substrate-like PCB (SLP) process

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Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

Orbotech in the media

£50m research centre with Bath Uni targets LEDs and radio technologies

A £50m project is aiming to be Europe’s leading centre for compound semiconductors such as gallium nitride and silicon carbide for LED, radio and power applications. The Compound Semiconductor Applications Catapult will be based in Newport, Wales, with support from the University of Bath. It is about to appoint a chief executive and create a technology campus.  

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£50m research centre with Bath Uni targets LEDs and radio technologies

Orbotech in the media

Acquisition sees boom time for semiconductor equipment

  • Date:
  • Source: EE News

Three years ago, US-Israeli printed circuit board inspection company Orbotech bought a semiconductor equipment maker in Wales in a surprise move. Today, SPTS retains its branding and is seeing a resurgence in LED manufacturing equipment and a range of opportunities for a new plasma dicing technology.

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Acquisition sees boom time for semiconductor equipment

Orbotech in the media

UK plans IMEC equivalent for compound semiconductors

  • Date:
  • Source: EE News

A £50m project in the UK is aiming to build the equivalent of the Belgian research company IMEC for compound semiconductors such as gallium nitride and silicon carbide for LED, RF and power applications.  

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UK plans IMEC equivalent for compound semiconductors

Orbotech in the media

Forging a bright future for IC and package quality

Vendors are taking a variety of approaches to boosting semiconductor quality and reducing time to market. Offerings range from instrument modules in PXI and LXI formats to complete test and related systems—and finally on to software that manages “data lakes,” applying AI/machine learning for analytics. Application areas are similarly varied—extending from analog to high-speed digital and on to RF, with wireless and IoT devices gaining considerable attention. SEMICON West, scheduled for July 11-13 in San Francisco, will provide companies an opportunity to highlight these products and technologies.

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Forging a bright future for IC and package quality