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Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0. To read the whole interview click the button below.
Printed-circuit-board quality challenges extend from design through production test and inspection and on to field diagnostics. Meny Gantz, VP of marketing for Orbotech’s PCB division, cited some key trends in the PCB arena. The increasing sophistication of smartphones, the proliferation of automotive electronics, the emergence of Industry 4.0, and the rollout of 5G are all leading to small-form-factor, high-density-interconnect (HDI) boards requiring fine traces with good impedance control, which in turn requires tighter control of conductor dimensions, he said.
The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the value of PCB production in 2016 was US$ 58.2 billion, representing a 1.9% decline compared to the previous year. But 2017 has brought about a change as the industry faces both challenges and opportunities. The recently released iPhone 8 and iPhone X require high-end HDI (High Density Interconnect) PCBs using advanced technologies such as mSAP (modified semi-additive process), which is a substrate-like PCB (SLP) process
Sharon Cohen, President, Orbotech West, explains how Orbotech translates ideas into reality providing the imaging and inspection tools to meet the needs of next-generation interconnection density.
Printed-circuit-board test and inspection becomes challenging as component sizes shrink and access disappears. Solutions include design and DFT software; probes and fixtures; in-circuit, flying-probe, and functional test; and optical and X-ray inspection as well as computed tomography. IPC Apex Expo 2017 scheduled for Feb. 11-16 in San Diego will provide a deeper look at the available tools.
NEW YORK — UBM has announced the finalists for the EDN and EE Times Annual Creativity in Electronics (ACE) Awards that honor technology innovators who demonstrate global electronics industry leadership. This year’s winners will be announced during an awards ceremony held Wednesday, December 7, alongside the Embedded Systems Conference (ESC) Silicon Valley at the San Jose Convention Center in San Jose, CA.
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