Orbotech in the media

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0. To read the whole interview click the button below.

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Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Orbotech in the media

Tools from software to X-ray systems round out PCB test and inspection

Printed-circuit-board quality challenges extend from design through production test and inspection and on to field diagnostics. Meny Gantz, VP of marketing for Orbotech’s PCB division, cited some key trends in the PCB arena. The increasing sophistication of smartphones, the proliferation of automotive electronics, the emergence of Industry 4.0, and the rollout of 5G are all leading to small-form-factor, high-density-interconnect (HDI) boards requiring fine traces with good impedance control, which in turn requires tighter control of conductor dimensions, he said.

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Tools from software to X-ray systems round out PCB test and inspection

Orbotech in the media

Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the value of PCB production in 2016 was US$ 58.2 billion, representing a 1.9% decline compared to the previous year. But 2017 has brought about a change as the industry faces both challenges and opportunities. The recently released iPhone 8 and iPhone X require high-end HDI (High Density Interconnect) PCBs using advanced technologies such as mSAP (modified semi-additive process), which is a substrate-like PCB (SLP) process

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Orbotech launches new AOI solution driving workflow innovation and improving yields of mSAP PCBs

Orbotech in the media

Video: Real Time with IPC

Sharon Cohen, President, Orbotech West, explains how Orbotech translates ideas into reality providing the imaging and inspection tools to meet the needs of next-generation interconnection density.

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Video: Real Time with IPC

Orbotech in the media

Tools extend from DFT software to X-rays

Printed-circuit-board test and inspection becomes challenging as component sizes shrink and access disappears. Solutions include design and DFT software; probes and fixtures; in-circuit, flying-probe, and functional test; and optical and X-ray inspection as well as computed tomography. IPC Apex Expo 2017 scheduled for Feb. 11-16 in San Diego will provide a deeper look at the available tools.

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Tools extend from DFT software to X-rays

Orbotech in the media

Orbotech Recognized as Deloitte Technology Fast 50 Company

The Deloitte Israel annual Technology Fast 50 program recognizes and honors the 50 fastest growing technology companies in Israel (private and publicly-held), based on percentage revenue growth over a four-year period. To qualify, companies must operate in any area of technology and own proprietary technology.

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Orbotech in the media

2016 ACE Awards Finalists Announced

NEW YORK — UBM has announced the finalists for the EDN and EE Times Annual Creativity in Electronics (ACE) Awards that honor technology innovators who demonstrate global electronics industry leadership. This year’s winners will be announced during an awards ceremony held Wednesday, December 7, alongside the Embedded Systems Conference (ESC) Silicon Valley at the San Jose Convention Center in San Jose, CA.

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2016 ACE Awards Finalists Announced

Orbotech in the media

Congratulations! UBM’s 2016 ACE Awards Finalists Announced

Design News’ parent company, UBM, in partnership with EDN and EETimes, has announced the finalists for the 2016 Annual Creativity in Electronics (ACE) Awards. The awards showcase the best in today’s electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. 

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