Media Coverage

The demand for smaller electronic products including burgeoning loT applications hos led to new focus on die size and wafer singulation. Richard Barnett, Etch Product Manager at SPTS Technologies explains how the benefits of plasma dicing grow as die continue to shrink.

Three Gwent-based businesses triumphed at the Welsh Business Awards, organised by the South and Mid Wales Chamber of Commerce at the National Museum of Wales. Newport hi-tech firm SPTS Technologies was victorious in the Commitment to Skills and People Development category. Multiple training opportunities, high staff retention levels, apprenticeships, on-site chiropractic and massage appointments, as well as a profit-related bonus for staff worldwide, all contributed to SPTS Technologies’ victory.  

Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving. According to Yole Développement in its Thin Wafer Processing & Dicing Equipment Market report, the dicing equipment market reached more than US$100 million in 2015 and will double by 2020-2021. Indeed, thin wafers are creating new challenges of significant interest in the dicing equipment industry such as die breakage, chipping, low die strength, handling issues and dicing damage...

... Mr Davis then travelled to south Wales to join a tour of SPTS Technologies, just off the M4, with Welsh Secretary Alun Cairns and Brexit Minister David Jones. The high-tech firm has grown steadily and now employs 280 on its site at Coldra.  STPS makes the machines that in turn make the leading edge technology that ends up in a range of devices, from sensors in airbags, parts of smart phones and LED lighting. It exports all over the world, with 30% of customers in the EU. 

The Deloitte Israel annual Technology Fast 50 program recognizes and honors the 50 fastest growing technology companies in Israel (private and publicly-held), based on percentage revenue growth over a four-year period. To qualify, companies must operate in any area of technology and own proprietary technology.

Design News’ parent company, UBM, in partnership with EDN and EETimes, has announced the finalists for the 2016 Annual Creativity in Electronics (ACE) Awards. The awards showcase the best in today’s electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. 

Plasma dicing has gained acceptance within the semiconductor industry as a viable alternative to conventional singulation methods using saw blades or lasers, with significant adoption across a range of applications.   The technology is based on deep reactive ion etching (DRIE)—also known as the “Bosch Process”—a dry plasma etch process that has been in production use for over 20 years within the MEMS and 3D Packaging markets.