Orbotech in the media

UK Ministers Visit SPTS

... Mr Davis then travelled to south Wales to join a tour of SPTS Technologies, just off the M4, with Welsh Secretary Alun Cairns and Brexit Minister David Jones. The high-tech firm has grown steadily and now employs 280 on its site at Coldra.  STPS makes the machines that in turn make the leading edge technology that ends up in a range of devices, from sensors in airbags, parts of smart phones and LED lighting. It exports all over the world, with 30% of customers in the EU. 

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Orbotech in the media

Orbotech Recognized as Deloitte Technology Fast 50 Company

The Deloitte Israel annual Technology Fast 50 program recognizes and honors the 50 fastest growing technology companies in Israel (private and publicly-held), based on percentage revenue growth over a four-year period. To qualify, companies must operate in any area of technology and own proprietary technology.

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Orbotech in the media

2016 ACE Awards Finalists Announced

NEW YORK — UBM has announced the finalists for the EDN and EE Times Annual Creativity in Electronics (ACE) Awards that honor technology innovators who demonstrate global electronics industry leadership. This year’s winners will be announced during an awards ceremony held Wednesday, December 7, alongside the Embedded Systems Conference (ESC) Silicon Valley at the San Jose Convention Center in San Jose, CA.

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2016 ACE Awards Finalists Announced

Orbotech in the media

Congratulations! UBM’s 2016 ACE Awards Finalists Announced

Design News’ parent company, UBM, in partnership with EDN and EETimes, has announced the finalists for the 2016 Annual Creativity in Electronics (ACE) Awards. The awards showcase the best in today’s electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. 

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Orbotech in the media

TAP Times: Plasma Dicing: Benefits and Process Considerations

Plasma dicing has gained acceptance within the semiconductor industry as a viable alternative to conventional singulation methods using saw blades or lasers, with significant adoption across a range of applications.   The technology is based on deep reactive ion etching (DRIE)—also known as the “Bosch Process”—a dry plasma etch process that has been in production use for over 20 years within the MEMS and 3D Packaging markets.   

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Orbotech in the media

i-Micronews: Thinner wafers are fostering the growth & emergence of new dicing technologies

Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving. “Reaching more than US$100 million in 2015, the dicing equipment market will double by 2020-2021”, announces Yole Développement (Yole) (Source: Thin Wafer Processing & Dicing Equipment Market report, Yole Développement, May 2016). Yet at the same time thin wafers are creating new challenges of significant interest in the dicing equipment industry such as die breakage, chipping, low die strength, handling issues and dicing damage...

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Orbotech in the media

Solid State Technology: Fan-Out Wafer Level Packaging: Breakthrough advantages and surmountable challenges

Our ability to create ever-smaller electronic devices that maintain or surpass the performance of their physically larger predecessors – exemplified by today’s wearables, smartphones and tablets – is dictated by many factors that extend well beyond Moore’s Law, from the underlying embedded components to the ways in which they’re packaged together. With regard to the latter, fan-out wafer level packaging (FOWLP) is quickly emerging as the new die and wafer level packaging technique of choice, and is widely antici- pated to underpin the next generation of compact, high performance electronic devices.

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Orbotech in the media

Chip Scale Review: 3D Backside Processing

Wafer backside processing is critical for 3D-IC wafer stacking. Through-silicon vias (TSVs) typically formed using viamiddle processing, are usually exposed from the backside of 300mm device wafers by the combination of mechanical grinding and wet or dry etch processes. A fast via reveal etch is required to have a productive etch rate, but also to have the precision necessary to control within wafer uniformity, selectivity to thin TSV liners and smoothness of postetch surfaces.   

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Orbotech in the media

i-Micronews: Fan-Out Wafer Level Packaging platform discussed with SPTS Technologies

Yole Développement recently had the opportunity to interview David Butler, VP of Product Management and Marketing at SPTS division within Orbotech. David shares his point of view on fan-out wafer level packaging platform with us.

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Orbotech in the media

2015 Industry Outlook: SPTS predicts it's 3D Etch, PVD, and CVD will reach HVM

In June 2014, SPTS co-produced a webinar with Ron Huemoeller of Amkor, titled “2.5D and 3D Packaging at the Tipping Point.” We forecasted that significant product announcements would be made over the next 18 months and we were right; sk Hynix, Samsung and Micron all announced readiness for their 3D stacked memory packages, and at the end of the year, AMD started risk production on a high bandwidth 2.5D interposer package, featuring a graphic chip next to four High Bandwidth Memory (HBM) stacks from sk Hynix. 

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Orbotech in the media

ITV News: 1,100 jobs created across Wales on eve of investment summit

  • Date:
  • Source: ITV News

ITV REPORT: 1,100 jobs created across Wales on eve of investment summit.  The jobs, based in both North and South Wales, will be in the financial and manufacturing sectors. They were announced today, on the eve of the UK Investment Summit at the Celtic Manor Resort in Newport.

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Orbotech in the media

Huge boost for Welsh economy as six companies create more than 1,100 new jobs

Six companies have announced more than 1,000 new jobs in Wales. In Newport, SPTS Technologies has been awarded a Welsh Government grant towards a three-year research project to develop advanced wafer processing solutions for high growth advanced packaging applications in the manufacture of the latest generation of integrated circuits and micro electro mechanical systems (MEMS). The project will create 30 full-time roles.

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