One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion

Newport, United Kingdom – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP physical vapor deposition (PVD) system for their new 300mm expansion.  HuaTian will use the Sigma to deposit under bump metallization (UBM) for their 300mm Flip Chip line and interconnects for their CMOS image sensor (CIS) packages.

“We have been seeing growing interest from specialist packaging houses in China wishing to strengthen their technology offerings, particularly as they look to bring cost-efficient 300mm capabilities on line,” stated Chris Jones, PVD marketing manager at SPTS Technologies. “Bumping is a cost-sensitive market, so customers appreciate the productivity advantages of our PVD systems.  For instance, we degas organic passivation layers at low temperatures without compromising system throughput – unlike competing systems whose long degas times result in fewer wafers per hour.”

The SPTS 300mm PVD system for bumping applications comprises wafer degas, pre-clean and PVD modules for depositing UBM layers in a Flip Chip process sequence.  Cost of ownership savings of more than 30% are achieved thanks to a unique approach to wafer degassing, a high rate pre-clean, and long life targets and chamber furniture. The same PVD modules can also be used to deposit Ti-Cu or Al alloy interconnects for redistribution layers (RDL) in CIS wafer level packaging.

Jones added, “HuaTian is an important and progressive customer who is positioning themselves for growth within the ramping Chinese market.  Their selection of our Sigma system is testament to our technical leadership and the quality of results we’ve achieved over competing systems. We look forward to working closer with HuaTian and supporting their success as they continue to expand their 300mm offerings.”

SPTS will be showcasing its range of etch, deposition and thermal equipment and technologies for advanced packaging on Booth #1317 (South Hall) at SEMICON West, 8th – 10th July, Moscone Center, San Francisco. 

Company Contact: 

Destanie Clarke, 
Tel: +44 7951 203278,

Cautionary Statement Regarding Forward-Looking Statements 

Some of the materials contained on this website (including in press releases, webcasts, presentations, posts and other places) contain forward-looking statements and are subject to the Safe Harbor provisions created by the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments, business strategies and industry trends and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These statements are only predictions and actual events or results may differ materially. We refer you to the documents KLA Corporation (“KLA”) files from time to time with the Securities and Exchange Commission, specifically, KLA’s most recent Annual Report on Form 10-K and Quarterly Reports on Form 10-Q.  These documents contain important factors that could cause the actual results to differ materially from those contained in projections and other forward-looking statements including, among others, volatility and cyclicality in the semiconductor equipment industry and other industries in which KLA and its subsidiaries operate, potential fluctuations in operating results and stock price, international trade and economic conditions, the ability to compete successfully worldwide, management of technological change and customer requirements, fluctuations in product mix within and among divisions, the timing and strength of product and service offerings by KLA and its subsidiaries and its and their competitors, intellectual property obsolescence and infringement, and factors associated with key employees, key suppliers, acquisitions, and litigation. Additional factors impacting the business of KLA and its subsidiaries include integration between KLA and its acquired companies, ability to achieve synergies and other benefits of acquisitions in the timeframe anticipated, if at all.

KLA and its subsidiaries assume no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.


This site is provided by KLA (or its subsidiaries) on an "as is" basis. None of KLA and its subsidiaries make any representations or warranties of any kind, express or implied, as to the operation of the site, or the accuracy or completeness of the information, content, materials, pricing, services, or products included on this site. Product specifications and prices are subject to change without notice, and products may be discontinued without notice. None of KLA and its subsidiaries will be liable for any damages of any kind arising from the use of this site, or the material that is provided on this site, including but not limited to direct, indirect, special, incidental, punitive, or consequential damages.