Kintex, South Korea, April 24, 2018 | Orbotech Ltd., a leading provider of process innovation technologies, solutions and equipment that are enabling the transformation of the global electronics manufacturing industry, will showcase a selection of its most innovative, direct imaging (DI), automated optical inspection (AOI), automated optical shaping (AOS) and inkjet/additive printing solutions for SLP/mSAP (substrate-like PCB/modified semi-additive process) and Flex PCB production and pre-production, at the 2018 KPCA show in Kintex, South Korea.
At the show, Orbotech will present its SLP/mSAP and Flex PCB production solutions including the innovative Nuvogo™ Fine 9 DI for patterning and Orbotech Diamond™ 8 DI for solder mask, along with the groundbreaking Precise™ 800 AOS solution which both removes excess copper and deposits missing copper to significantly increase yield. At the Orbotech KPCA booth, visitors will also see how all these solutions are supported by Industry 4.0 compliant Orbotech Smart Factory and Frontline’s InCAM® Flex and InPlan® Flex CAM data optimization and planning tools.
Orbotech will also demonstrate the recently launched 4-in-1 Ultra Dimension™ 800 AOI solution with integrated pattern inspection, laser via inspection, remote multi-image verification (RMIV) and 2D metrology. Orbotech’s new vision is to simplify the complex inspection process for advanced PCB manufacturing. The new AOI room concept is designed to enable manufacturers to increase their quality and yields while reducing their overall total cost of ownership (TCO).
“As one of the most advanced PCB manufacturing markets, we are looking forward to KPCA 2018 and to presenting our latest, most advanced DI, AOI, AOS and Industry 4.0 solutions to SLP/mSAP and flex PCB manufacturers,” said Mr. Avihou Barkay, President of Orbotech Asia East, PCB. “We are constantly developing innovative solutions such as Orbotech Diamond™ 8 solder mask DI and Ultra Dimension™ 800 AOI to help our customers gain unique advantages on top of increased yields and reduced costs.”
About Nuvogo™ Fine 9 (DI): Nuvogo Fine 9 is a member of Orbotech's industry-leading Direct Imaging (DI) solutions for the SLP/mSAP, advanced HDI & FPC PCB applications. Providing total synergy between Orbotech's state-of-the-art optics, mechanics and electronics, Nuvogo Fine 9 offers fine resolution (L/S=10/15µm) with superior imaging quality and exceptional throughput. Nuvogo Fine incorporates Orbotech's field-proven Large Scan Optics (LSO) Technology™, delivering unmatched high Depth-of-Focus (DoF), and imaging uniformity.
About Ultra Dimension™ 800 (AOI): Ultra Dimension 800 is the first AOI solution to perform both pattern and laser via inspection in a single scan. Powered by Orbotech’s proprietary Triple Vision Technology™ and Magic Technology™, Ultra Dimension 800 improves detection, reduces false alarms and decreases inspection setup time. Ultra Dimension 800 provides manufacturers of advanced PCB processes with the flexibility to inspect a variety of applications and materials without any compromise.
About Precise™ 800 (AOS): The groundbreaking Precise 800 is a superior AOS solution for the advanced HDI and complex multi-layer PCB manufacturing market, capable of both ablating excess copper (“shorts”) and depositing missing copper (“opens” and “nicks”), all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise™ 800 addresses multiple defects including those on inner and outer layers, multiple lines, corners and pads.
About Orbotech Diamond™ 8 (DI): Orbotech Diamond 8 is Orbotech’s highly accurate high-throughput mass production DI solution for solder mask. Powered by Orbotech SolderFast Technology™, Orbotech Diamond 8 is the leading mass production Direct Imaging solution. It is especially suited for very complex designs, improving throughput, yield and productivity. The Orbotech Diamond 8 DI solution incorporates Orbotech SolderFast Technology which employs a wide UV spectrum to ensure fast throughput and high quality on a variety of solder resists. Patented optics and high energy illumination enable wide D.o.F (Depth of Focus), ensuring consistent, precise imaging quality to overcome the most challenging surface topography variations as well as any distortions or abnormalities.
About Orbotech Smart Factory: Orbotech Smart Factory for Industry 4.0 compliant solutions for integrated PCB production connects all Orbotech products, enabling real-time production analysis, bi-directional communication and data sharing, traceability and on-demand data analysis.
About InCAM® Flex and InPlan® Flex: InCAM®Flex is a dedicated CAM solution for flex and rigid-flex PCB makers that provides precise CAM tooling and production data optimization via flex design for manufacturing tools making the most out of flex production. InPlan®Flex is a comprehensive automatic engineering system for rigid, flex and rigid-flex PCBs that combines sophisticated engineering know-how with state-of-the-art preproduction planning tools to design the optimal manufacturing process paving your path to business success.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com/ and www.spts.com/
Cautionary Statement Regarding Forward-Looking Statements
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.
The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
For more information, please contact:
Tally Kaplan Porat
Director of Corporate Marketing
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