May 31, 2016

 
The Nuvogo™ Fine targets a new PCB manufacturing industry standard for Advanced HDI and Flexible PCB Production of thinner devices

YAVNE, IsraelMay 31, 2016 /PRNewswire/ --

ORBOTECH LTD. (NASDAQ: ORBK), a leading provider of process innovation technologies, solutions and equipment serving the global electronics manufacturing industry, today launched the Nuvogo Fine at JPCA 2016 in Tokyo, Japan. The Nuvogo Fine is specifically designed for new production methods and technologies, in particular for advanced high density interconnect (HDI), including modified semi-additive process (mSAP) and flexible printed circuits (FPC) at exceptionally high throughput on all types of resists. As the industry continues to move towards thinner, smarter and smaller devices and existing production technologies are reaching their limits, new production processes such as mSAP are enabling the high-volume manufacture of ultra-fine resolution printed circuit boards (PCB) to achieve superior imaging quality. This next-generation solution is designed to enable this process as the PCB manufacturing industry adapts to mSAP to tackle these upcoming challenges.

"As the industry moves toward wearables and smartphones with increasingly thinner form factors and higher functionality, HDI manufacturing processes must adapt in order to support this demand," said Arik Gordon, Corporate Vice President and President of Orbotech's PCB Division. "Orbotech's quick response time to these changing dynamics, ensures our ability to stay at the forefront of PCB manufacturing. The Nuvogo Fine provides exceptional precision to support today's advanced designs with streamlined production processes. This winning combination will, in turn, ensure that our customers stay ahead of the competition and answer designers' needs with fast throughput, increased yield and lower total cost of ownership."

About the Nuvogo Fine 

The Nuvogo Fine is driven by Orbotech's proven state-of-the-art optics, mechanics and electronics. Capable of providing a line width of 10μm and yields of up to 5500 panels per production line, per day, the solution offers exceptionally fast panel production speeds, accelerating time-to-market while enabling a very low cost-per-print.

With its dual table, the Nuvogo Fine is able to print in advanced scaling modes with nearly no loss of throughput.  The system is built to streamline and optimize high volume PCB production of extremely dense designs, offering advanced quality and efficiency features.  In addition, the Nuvogo Fine boosts registration accuracy enabling the high precision stacking of microvias.

Enabling Industry Leading Precision with Exceptional Yield 

Powered by Orbotech's MultiWave Laser Technology™ and Large Scan Optics Technology™ (LSO), the Nuvogo Fine offers precision line quality and pattern uniformity without sacrificing production speed. The field-proven LSO technology enables line structure and uniformity with exceptional depth-of-focus (DoF) using a single panel scan, ensuring superior results even on the most challenging of topologies. The MultiWave Laser Technology™ produces sharper edge patterns and maximizes flexibility by matching any resist to fit all practices. The adaptable multi-wavelength laser offers superior uniformity of in-line structure quality.

Orbotech's advanced manufacturing technologies provide PCB manufacturers with the precision and accuracy needed for the fast growing electronic devices industry. The Company remains focused on the need to maintain exceptional throughput and yield to ensure manufacturers' profitability and to satisfy end user requirements for fast time-to-market.

The Nuvogo Fine is now available to customers worldwide.

About Orbotech Ltd. 

Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com 

Cautionary Statement Regarding Forward-Looking Statements 

Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company's global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the Company's ability to achieve strategic initiatives, including related to its acquisition strategy, the Company's debt and corporate financing activities; the final timing, outcome and impact of the criminal matter expected in mid- to-late 2016 and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean Matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2015, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law. 

COMPANY CONTACTS:

Anat Earon-Heilborn
Director of Investor Relations
Orbotech Ltd.
Tel: +972-8-942-3582
Investor.relations@orbotech.com

Tally Kaplan Porat
Head of Corporate Marketing
Orbotech Ltd.
Tel: +972-8-942-3603
Tally-Ka@orbotech.com

 

SOURCE Orbotech Ltd.

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