Orbotech’s mSAP-supporting solutions include the Nuvogo™ Fine Direct Imaging, Precise™ 800 Automated Optical Shaping and the Ultra Fusion™ 320 Automated Optical Inspection

Kintex, South Korea, April 28, 2017 | Orbotech Ltd., a leading provider of process innovation technologies, solutions and equipment that are enabling the transformation of the global electronics manufacturing industry, recently demonstrated a selection of its newest, most innovative, mass production PCB manufacturing solutions at KPCA 2017. Following the local Korean PCB industry’s recent shift to manufacturing ultra-fine resolution printed and flex circuit boards, Orbotech highlighted its comprehensive range of pre-production, production and yield management solutions that support mSAP (modified semi-additive process) and advanced HDI.
The company also showcased its new Orbotech Smart Factory solution for Industry 4.0. The solution connects with all Orbotech products, enabling real-time production analysis, bi-directional communication and data sharing, together with traceability and on-demand data analysis. In addition, Orbotech presented InCAM®Flex and InPlan®Flex, its CAM and engineering software solutions.
During KPCA, Orbotech was invited to present a session on its Orbotech Smart Factory solution at the show’s NPI (New Product Introduction) Seminar. During the seminar, Orbotech's PCB Industry Marketing Director, Mr. Shavi Spinzi, emphasized how the company's Industry 4.0 compliant solution is already helping customers throughout Asia to optimize their productivity and providing them with the traceability tools for comprehensive monitoring. Mr. Spinzi also demonstrated an mSAP use case for Industry 4.0.
“Our Korean customers were delighted with our wide range of Industry 4.0 compliant, high-volume mSAP and advanced HDI manufacturing solutions which tackle head on the production challenges that they currently face. We believe that Orbotech Smart Factory will truly enable the Korean market to retain its competitive advantage while reducing operational expenses,” said Mr. Yair Alcobi, President of Orbotech Asia East. “Orbotech prides itself on its technological leadership and we work tirelessly with our customers to develop the innovative technologies and production tools to meet both todays and tomorrow’s manufacturing challenges.”
Production solutions presented at KPCA 2017 include:
Orbotech Diamond™ 8: Orbotech Diamond™ 8 is a mass production, high throughput and highly accurate solder mask DI solution. Powered by Orbotech SolderFast™ Technology, Orbotech Diamond 8 enables high throughput and superior imaging quality and accuracy. Orbotech Diamond 8's sophisticated optical mechanism enables high Depth-of-Focus for the most challenging surface topographies, and significantly decreases Total Cost of Ownership (TCO).
Ultra Fusion™ 320+ 2D Metrology: Ultra Fusion™ 320 is an mSAP and advanced HDI AOI solution, which is a part of the Orbotech market-leading, high performance AOI family, based on the Multi-Image Technology™ for superior detection and false-alarm reduction.Orbotech’s Ultra Fusion 320 can now be further enhanced with automated 2D Metrology IPQC (In-process Quality Control), enabling continuous automatic inline measurement of both top and bottom conductor widths, ensuring accurate and repeatable measurements results with fast and simple sampling and advanced traceability.
Precise™ 800: The groundbreaking Precise™ 800 is the first and only ‘one-stop’ Automated Optical Shaping (AOS) solution for mSAP, advanced HDI and complex multi-layer PCB manufacturing market, capable of both ablating excess copper (“shorts”) and depositing missing copper (“opens” and “nicks”), all in a single automated process. Enabling accurate, high quality 3D shaping of the most advanced PCB designs, the Precise 800 significantly increases yield by virtually eliminating PCB scrap. The Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.
InCAM®Flex and InPlan®Flex: InCAM®Flex and InPlan®Flex are software solutions for rigid, flex and rigid-flex PCB production. InCAM®Flex is a dedicated CAM solution that combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling for flex and rigid-flex manufacturing. InPlan®Flex is a comprehensive automatic engineering system that combines sophisticated engineering know-how with state-of-the-art preproduction planning tools to design the optimal manufacturing process.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components.
Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com/ and www.spts.com/
For more information, please contact:
Tally Kaplan Porat
Director of Corporate Marketing
Orbotech Ltd.
Tel: +972-8-942-3606

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