Rapier-300S Overcomes Singulation Challenges of Ultra-Small and Ultra-Thin Devices in Volume Production

NEWPORT, UK | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, has introduced the Rapier-300S plasma etch module, the latest addition to its Mosaic™ plasma dicing platform. The Rapier-300S singulates 300mm wafers on 400mm taped frames, and offers significant throughput and yield benefits for manufacturers of ultra-small and ultra-thin devices. Using SPTS’s industry leading deep reactive ion etch (DRIE) technology, the Rapier-300S offers the tight process control and fast etch rates necessary to achieve the high yields and throughput required for this cost sensitive step.

 “As devices continue to shrink, singulation by plasma etching offers considerable benefits for die quality and strength as compared to traditional dicing solutions,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “With wafer thicknesses trending below 50µm, conventional dicing methods are reaching their limits. Ultra-small and ultra-thin devices like RFID chips or fragile devices like MEMS are more susceptible to damage from the vibration and chipping caused by mechanical saws, or from the heat caused by lasers. Plasma dicing is a purely non-contact chemical process, thus offering a far less damaging method of singulating devices when they are in their most valuable state. With customers already qualifying devices on 300mm, and in volume production on 150mm and 200mm, our plasma dicing solutions are well positioned to be the benchmark technology for fabs seeking to increase throughputs and yields for small or thinned fragile die.”

The Rapier-300S is a silicon DRIE module, designed specifically for dicing of 300mm wafers mounted on 400mm frames.  It builds on SPTS’s experience in plasma singulation of 150mm, 200mm and 300mm wafers. Unique aspects of SPTS’s plasma dicing technology include the use of SPTS’s patented Claritas™ end-point detection system, which provides the earliest possible detection of the lane clearing, allowing the use of patented “bias pulsing” techniques to prevent lateral damage of the die sidewall.

The Rapier-300S can etch die of any shape with dicing lanes below 10µm and accommodates wafer thicknesses up to and including full wafer thickness. For the smallest die, for example RFID devices (at~0.04mm2), the adoption of narrow dicing lanes could provide up to 80% more die per wafer, at much higher throughputs since all dicing lanes are etched in parallel. Plasma dicing also gives device designers much greater flexibility with regards to fundamental die position/shape/size, removing guard rings and positioning of die/test groups, to make better use of the wafer area.

SPTS Technologies will be showcasing the Rapier-300S, which has been shortlisted for the Best of West Awards, at SEMICON West, Booth No. 1417 in South Hall, July 12 – 14, Moscone Center, San Francisco, Calif. The “Best of West” awards which are presented annually by Solid State Technology and SEMI at SEMICON West was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

To learn more about SPTS’s Rapier-300S, the Mosaic plasma dicing platform, and full range of industry leading etch and deposition process solutions, visit us on Booth #1417 in South Hall. To arrange a meeting with a member of our team, email enquiries@spts.com.

 

####

About SPTS Technologies

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com

About Orbotech Ltd.

Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

 

COMPANY CONTACTS:

Destanie Clarke

Senior Director, Marketing Communications

SPTS Technologies

Tel: +44 7951 203278

Destanie.Clarke@orbotech.com

 

Tally Kaplan Porat      

Head of Corporate Marketing

Orbotech Ltd.

Tel: +972 8 942 3603                                                                          

Tally.KaplanPorat@orbotech.com

Cautionary Statement Regarding Forward-Looking Statements

Except for historical information, the matters discussed in this website (including in press releases, webcasts, presentations, posts and other places) are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events as of the date of the applicable information (press releases, webcasts, presentations, or posts) and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. This information is also supplemented by the information in the applicable document on this website (e.g., press release, webcast, presentation, posts and other document). The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.