6th March 2019
Ramping up the Power – 300mm PVD for Metallization of Silicon IGBTs and other Power Semiconductor Devices
This webinar discusses how physical vapor deposition (PVD) can be used to deposit both thick frontside metal, and thinner multi-layer backside metals deposited after wafer thinning. The presentation will give details of how SPTS Sigma® PVD technology overcomes various challenges which can affect yields in power device manufacturing, including eliminating whiskers during thick metal deposition, avoiding contamination from organics, active-face protection and stress control of backside layers on thinned wafers.
For more information, click here.
19th June 2018
Advances in doped AlN deposition techniques for next generation PiezoMEMS
In this webinar we present a novel solution providing symmetrical control and adjustment of stress for AlN films with different Sc content. We demonstrate excellent WIW stress performance, the ability to locally tune stress to compensate for centre to edge variations in Sc, and approaches to prevent formation of crystallite defects, maximizing yield.
21st March 2018
Solving the Plasma Dicing Puzzle
This webinar will discuss the integration of plasma dicing into volume production, including cost implications, the influence of tape selection, and end-point options for process control in volume production. Of topical note is the combination of LASER and plasma for quicker avenues to adoption and this session will cover how the plasma etch can accommodate the side effects of LASER grooving, showing examples of this approach and the benefits that can be achieved.
22nd Feb 2018
MVD for MEMS
This seminar will introduce specialized coatings for manufacturing MEMS and related devices. This will include hydrophobic and anti-stiction coatings, and very thin, transparent films for moisture barriers and corrosion avoidance.
28th September 2017
This webinar discusses in detail the mechanisms behind Rc increase, with a focus on degas and pre-clean stages of the UBM/RDL process flow. A comparison of techniques used in production today to manage the issue will be presented. Finally, a novel approach to produce low and stable Rc performance in volume production for current and next generation device packaging schemes will be introduced.
30th August 2017
This webinar focuses on SPTS’s approach to SiC etching, based on the unique Synapse™ process module with a plasma density that is ten times higher than standard ICP reactors. We will give examples of deep SiC back-side via etching for GaN devices as well as shallower trench structures on the front-side of SiC wafers. Our focus will be on high productivity process solutions consistent with the increasing demand for volume production of these device types.
15th December 2016
Designers are starting to use Aluminum Nitride (AlN) and other piezo materials by physical vapor deposition (PVD) for a new range of high performance MEMS devices such as microphones, finger print sensors, energy harvesters, speakers and Si oscillators. This webinar examines how the success of deposition of AlN by PVD for the established RF BAW market has provided a roadmap to develop these new MEMS based applications. You will hear how new material requirements and film properties are being met with SPTS’s latest Sigma fxP PVD hardware and technologies.
14th September 2016
Continuing our webinar series on Advanced Packaging applications we are pleased to have presented our webinar on Plasma Dicing on Wed 14th Sept 2016, which was co-hosting with Amandine Pizzagalli, Technology & Market Analyst at Yole Développement.
During the webinar, Yole Développement will gave its vision and an overview of the key dicing technologies across MEMS devices, power devices, CMOS image sensors, and RFID devices, highlighting its major findings on the evolution and trends of the dicing technologies.
SPTS presented the latest data illustrating how processing routes affect die strength, share experiences with different types of tapes and other die features such as solder balls. We shared details of the latest equipment which is now available for plasma dicing wafers up to 300mm (on 400mm tape frames) for full production applications.
13th October 2015
Fan-Out Wafer Level Packaging (FOWLP) is the fastest growing format in the advanced packaging sector. In Oct 2015, Yole revised its projections to show a 32% CAGR through 2020 as TSMC enters the fray with its InFO product. InFO is just one of a number of different FOWLP formats that are being proposed to meet the industry goals of high density performance at low cost.
All the FOWLP formats embed die in an epoxy mold compound (EMC), and build dense I/O connections outside the periphery of the die, hence the name “Fan-Out”. The use of EMC presents significant challenges to the makers of RDL and UBM deposition equipment.
During this webinar, hear why FOWLP is receiving such attention, and learn how SPTS deals with the challenges of depositing UBM/RDL metal on EMC substrates and explain why SPTS is the leading PVD supplier to this important market.
13th May 2015
The key to successful introduction of plasma dicing is how to integrate this front-end technology into the back-end process flow. This webinar shows how various schemes can be used to allow plasma dicing to enter the process flow as seamlessly as possible, whilst also introducing SPTS’s Mosaic production plasma dicing system and its range of capabilities.