Orbotech's field-proven range of DI systems are especially designed to handle even the most challenging FC-BGA, FC-CSP, BGA/CSP and modules...
Direct Imaging for Patterning
Decrease cost of ownership while maintaining optimal quality at high speeds
Orbotech’s direct imaging (DI) solutions for patterning enable PCB manufacturers to achieve the best imaging results with the highest throughput.
Our DI systems help decrease overall cost of ownership while maintaining optimal quality at high speeds. Orbotech DI systems, powered by MultiWave Laser Technology™, and based on Orbotech’s field-proven LSO Technology™ achieve enhanced Depth-of-Focus for superior results on panel topography changes, as well as best line uniformity.