Emerald™ 160 Series
A new level of advanced UV drilling performance for today’s most challenging IC substrate and assembly applications.
Emerald™ 160F consistently meets the demands of increasingly complex designs to ensure maximum performance and cost savings. Emerald™ 160F was specifically designed for flip-chip ball grid array (FCBGA) substrates and low temperature co-fired ceramic (LTCC). the Emerald™ 160F has improved beam quality and superior accuracy down to 6μm and is optimized to support high-accuracy and high throughput laser processing applications including advanced packaging, 2.1D packaging and embedded die.
