Emerald™ 160 Series

A new level of advanced UV drilling performance for today’s most challenging IC substrate, flex circuit and assembly applications.


Emerald™ 160 series consistently meets the demands of increasingly complex designs to ensure maximum performance and cost savings. Emerald™ 160 was specifically designed for fcCSP/fcBGA substrates and LTCC with 10μm accuracy and 18μm spot size, the Emerald™ 160i has improved beam quality and superior accuracy down to 6μm and 15μm spot size and was optimized to support advanced packaging applications like organic interposers/2.1D and embedded die. It also addresses other high-accuracy and high TP laser processing applications such as flex circuit, patterning, skiving and routing.

Inquiry about: Emerald™ 160 series for via formation

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