Paragon Ultra Family

Offers new levels of DI performance for FC-CSP, FC-BGA and modules manufacturing

Orbotech's field-proven range of DI systems are especially designed to handle even the most challenging FC-BGA, FC-CSP, BGA/CSP and modules applications. This breakthrough in fine-line imaging, high DI throughput and superior registration accuracy, delivers unmatched imaging results.

The systems feature Orbotech’s patented LSO Technology™ which can image ultra-fine lines down to 8µm. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 20µm. For advanced BGA/CSP subtractive production, our system provides throughput of up to 110 prints per hour.

Leading IC Substrates manufacturers are already using Orbotech DI systems to meet their advanced FC-BGA, FC-CSP, BGA/CSP and Modules production needs, to achieve higher yields that significantly lower their bottom-lines costs, while increasing their ROI.

Product Line Width Range (µm)
Paragon™ Ultra 300 (high capacity)  8µm with 20µm pitch
Paragon™ Ultra 200X (standard capacity) 8µm with 20µm pitch

Inquiry about: IC substrates: Paragon Ultra family

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