Paragon Ultra Family
Offers new levels of DI performance for FC-CSP, FC-BGA and modules manufacturing
Orbotech's field-proven range of DI systems are especially designed to handle even the most challenging FC-BGA, FC-CSP, BGA/CSP and modules applications. This breakthrough in fine-line imaging, high DI throughput and superior registration accuracy, delivers unmatched imaging results.
The systems feature Orbotech’s patented LSO Technology™ which can image ultra-fine lines down to 8µm. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 20µm. For advanced BGA/CSP subtractive production, our system provides throughput of up to 110 prints per hour.
Leading IC Substrates manufacturers are already using Orbotech DI systems to meet their advanced FC-BGA, FC-CSP, BGA/CSP and Modules production needs, to achieve higher yields that significantly lower their bottom-lines costs, while increasing their ROI.
|Product||Line Width Range (µm)|
|Paragon™ Ultra 300 (high capacity)||8µm with 20µm pitch|
|Paragon™ Ultra 200X (standard capacity)||8µm with 20µm pitch|