1. MEMS & Sensors Executive Congress - MSEC 2019

      SPTS Technologies are pleased to announce that we are Gold Sponsorship for the MSEC 2019 event that will be taking place at the Hotel Del Coronado, San Diego from 22 - 24 October 2019. Join the top thinkers in MEMS and Sensors as they break down the challenges facing the
  2. IWLPC 2019

      SPTS Technologies are pleased to announce that we will be presenting at the International Wafer-Level Packaging Conference taking place at the Double Tree by Hilton in San Jose from 22 - 24 October 2019.  Improved Semiconductor Device Reliability from Plasma Dicing Richard Barnett, Senior Product Manager - Etch  Wednesday 23rd
  3. SEMI MEMS & Imaging Sensors Summit

    SPTS Technologies are proud Silver Sponsors of the 2019 SEMI MEMS & Imaging Sensors Summit taking place from 25 - 27 September 2019 at Minatec, Grenoble, France. This unique event brings together the stakeholders from MEMS, Imaging and Sensors supply chains together to discuss new technologies, smart integration of sensors for
  4. SEMICON Taiwan 2019

    SPTS Technologies will be exhibiting at SEMICON Taiwan 2019, taking place at Taipei Nangang Exhibition Center, from 18 - 20 September 2019. SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. SPTS Technologies will once again exhibit and connect with the companies, people, products and information shaping the
  5. Privacy Policy

    your privacy and want you to be familiar with how we collect, use and disclose information. This privacy policy, (together with our terms of use), sets out the basis on which any personal data we may collect from you, or that you provide to us, will be processed by us
  6. Literature Library

    Application Briefs Case Studies SPT Microtechnologies (Thermal Products) Application Briefs
  7. Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

    Orbotech Smart Factory provides the manufacturer with a smart solution based on visibility, traceability, accurate data, optimization of production services, and much more. The solution sits on a central server and communicates with all Orbotech equipment, gathering data and providing significant actionable information to customers. Matties: Being inside the Orbotech
  8. Circuiti Flessibili: Innovazioni e processi

    non richiedono lo strato adesivo – il rame è depositato invece direttamente sul polyimide. Questi circuiti a due strati possono essere di soli 30 µm di spessore, con interlinea di soli 15 µm (0,6 mils). È essenziale di conseguenza che i pannelli elaborati siano trattati con estrema cautela per evitare