1. SPTS Ships Etch Solutions to Europe's Leading R&D Organisations

    R&D orders affirms SPTS versatility in leading edge etch applications Newport, United Kingdom, 4 Apr, 2013 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced it has received multiple orders from several of the Europe’s leading research and
  2. SPTS Debuts Low-Temperature PECVD Technology for 3D-IC

    Low temperature dielectrics with degas capability addresses two post-TSV packaging challenges Newport, United Kingdom, 19 September 2012 – SPTS Technologies, a leading supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the availability of its low temperature plasma-enhanced chemical vapour deposition (PECVD
  3. SPTS Leading the Way in Via Reveal Etch Solutions

    Process flexibility and unique end-point solution improve yields for post-TSV processing   ]Newport, United Kingdom AND SEMICON Taiwan, 5 Sept, 2012 – SPTS Technologies, a leading supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced its industry leading dry etch process technology for
  4. SPTS Announces Multi-System Orders for C2MI

    SPTS is pleased to be selected as one of their prime manufacturing partners,” said Kevin T.Crofton, executive vice president and chief operating office at SPTS. “ We look forward to collaborating with the technologists at C2MI to advance their MEMS and packaging development activities and help to bring them to
  5. SPTS Expands Chinese Customer Base with PVD Win

    proud to be part of China’s developing compound semiconductor device manufacturing industry,” said Kevin T. Crofton, executive vice president and chief operating officer at SPTS Technologies. “We look forward to contributing to our customer’s success in their production ramp.” This is SPTS’ second new Chinese customer announcement in
  6. SPTS Installs First Vapor HF Release Etch System in China

    system uses a 3-wafer process module to increase throughput without compromising process repeatability, providing high uptime and low cost of system ownership. About the SPTS Primaxx® Release Etch Technology SPTS is the world leader in reduced pressure, residue-free MEMS dry etch release, a critical buried oxide etch step