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Automated Optical Shaping
Orbotech AOS technologies drive the market’s only fully automated solutions, enabling manufacturers to achieve high-speed, quality shaping of both opens and shorts that are identified along the PCB production line. Manual repair of panels below 50µm is challenging in complex fine-line PCB production, as it often damages adjacent conductors as well as the laminate. Orbotech AOS technologies overcome traditional limitations of manual repair, enabling the shaping of any layer on advanced HDI and complex multi-layer boards.

Orbotech AOS solutions enable PCB manufacturers to overcome all production challenges including those posed by new processes. With Orbotech AOS, manufacturers can increase yield, achieve significant cost-savings and increase competitiveness by reducing their need to scrap panels on the most advanced, complex, fine-line PCBs, which in the past were beyond salvage.

The Orbotech AOS family includes two categories of solutions, Precise™ which 3D shapes both copper shorts and opens and Perfix™ which automates the shaping process for shorts only.

Precise™ 800 is the world’s first one-stop 3D shaping solution. A unique innovative implementation of digital additive manufacturing, it represents a complete breakthrough in electronics micro-manufacturing production processes.The Precise 800 eliminates practically all PCB scrap by shaping both excess and missing copper defects, all in a single automated process. This AOS system enables top quality shaping of opens and shorts in the most advanced PCB designs, including any-layer, advanced HDI and complex multi-layer boards. Precise 800 addresses all defects including those on inner and outer layers, multiple lines, corners and pads.

Perfix™ 200S and Ultra Perfix™ 120S AOS solutions respectively deliver unmatched shaping quality and accuracy for copper shorts down to 30µm and 10µm lines and spaces. Orbotech Perfix solutions deliver the highest quality shaping of shorts in the most advanced PCB designs, including any-layer, HDI and complex multi-layer and IC Substrate boards.

AOS solutions benefits:

Maximum yield, minimum scrap – Accurate shaping of complex or fine defects saves PCBs that might otherwise have been scrapped, allowing PCB manufacturers to dramatically increase their yield and reduce their scrap

One-stop AOS solution: Precise™ 800 – World’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing

Superior quality – High accuracy shaping works to eliminate defects as if they were never there

High-speed automated shaping – Ideal solutions for high-volume production environments

Low TCO – Easy-to-operate solutions which enable up to 75% savings on manpower

With Orbotech’s unique AOS technology, PCB manufacturers can realize increased competitiveness and profitability by shaping advanced fine-line, high performance and IC Substrate PCB panels. The following are the members of the Orbotech AOS family of solutions:

Precise™ 800               
Excess Copper: Down to 25μm line and space
Missing Copper: Down to 30μm line and space
PerFix™ 200S

Excess Copper: Down to 30µm line and space
Ultra PerFix™ 120S

Excess Copper: Down to 10µm line and space
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