"Advances in doped AlN deposition techniques for next generation Piezo-MEMS" N. Knight

(SEMICON Europa 2018)

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"Trends in Plasma Processes for SiC/GaN for Power Applications" R. Barnett

(SEMICON Taiwan 2018)

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"Still Puzzled about Plasma Dicing?" R. Barnett

(SEMICON Taiwan 2018)

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"Overcoming PVD Production Challenges of AlScN PiezoMEMS" A. Barker

(SEMICON Taiwan 2018)

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"Novel End-Point solution for improvement in Die Strength and Yields with Plasma Dicing (AG) in volume production" Jo Carpenter

(EPTC 2017)

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"Plasma Dicing: The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die" R. Barnett

(Yole Dev. Tech Symposium 2017)

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"Laser via formation for advanced packaging" N. Bar-Yaakov

(SEMICON Taiwan 2017)

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"Improving the productivity of Plasma Etch processing for PiezoMEMS applications" R. Barnett

(SEMICON Taiwan 2017)

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"Fantastic Fan-Out. Improving interconnect productivity for the fastest growing packaging platform" A. Barker

(SEMICON West 2017)

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"RC Management for next generation PVD UMB/RDL Metallization Schemes" N. Knight

(CSPT 2017)

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"Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die" R. Barnett

(SEMICON SEA 2017)

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"How Plasma Dicing is Becoming Mainstream" D Butler

(SEMI European 3D Summit 2017)

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"Extreme Wafer Thinning to 5μm for Low Cost Via-Last" D. Thomas

(SPTS/imec joint paper at 3D-ASIP 2016)

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"How Plasma Dicing is Finally Becoming Mainstream" R. Barnett

(Be-Flexible 2016)

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"High Productivity UBM/RDL Deposition By PVD For FOWLP Applications" C.Jones

(IWLPC 2016)

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"Plasma Dicing: More Die, Stronger Die" R. Barnett

(SEMICON Taiwan 2016)

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"Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS" N. Knight

(SEMICON Taiwan 2016)

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"Deep Silicon Etching - Increasingly Relevant > 20 years on!" D. Thomas et al

(ECS 2016)

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"FOWLP Goes Mainstream. PVD Solutions For The Fastest Growing Packaging Format" D. Butler

(3D Summit 2016)

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"More Die, Stronger Die. Smaller, Thinner, Packages Drives Die Singulation by Plasma Etch" D. Butler

(3D ASIP 2015)

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"Impact of Backside Processing on C-V Characteristics of TSV Capacitors in 3D stacked IC Process flows" D. Thomas et al

(EPTC 2015)

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"Improving device yields and throughput using plasma dicing" R. Barnett et al

(IWLPC 2015)

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"Comparison between wet and dry silicon via reveal in 3D backside processing" D. Thomas et al; SPTS/imec joint presentation

(IWLPC 2015)

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"Aluminium Nitride Piezoelectric Technology for Next Generation MEMS" D Butler

(MEMS Manufacturing, Santa Clara, Aug 2015)

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"High Density Packaging on Wafer Level Fan-out: Deposition and Via Drilling Solutions Tailored for Non-Silicon Substrates" D Butler

(SEMI European 3D-TSV Summit, Grenoble, Jan 2015)

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