Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within the plasma to induce reactions at the wafer surface that would otherwise require higher temperatures associated with conventional CVD. Energetic ion bombardment during deposition can also improve the film's electrical and mechanical properties.

Delta Deposition Systems

SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductor, and advanced packaging industries, particularly in applications where a low processing temperature is required.