Wafer sizes from 75mm to 300mm Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity Up to 10 gas lines and optional...
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within the plasma to induce reactions at the wafer surface that would otherwise require higher temperatures associated with conventional CVD. Energetic ion bombardment during deposition can also improve the film's electrical and mechanical properties.
Delta Deposition Systems
SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductor, and advanced packaging industries, particularly in applications where a low processing temperature is required.