The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability...
Single Wafer Platforms
To address the requirements of both volume manufacturing, pilot production and R&D applications, SPTS offers their etch and deposition process technologies on a range of wafer-handling platform options:
fxP - an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.
c2L - a smaller production system for 3 – 8” wafers, supporting up to 3 process modules for flexibility and control.
LPX - combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.