PVD for Advanced Packaging
High productivity PVD for UBM/RDL metallization in FOWLP and other applications
With the adoption of organic passivation and new substrate materials the technical challenges for UBM/RDL deposition are in the areas of pre-treatment.
Using novel degas and pre-clean technology, the Sigma® fxP produces consistently low Rc values whilst delivering a 2x throughput advantage over other PVD tools.
Copper barrier/seed deposition with excellent step coverage in high aspect ratio through silicon vias
SPTS' Advanced Hi-Fill Ionized PVD source delivers world class step coverage for PVD Cu barrier/seed in high aspect ratio features. SPTS also offers extendibility beyond PVD for TSV Cu barrier seed with its C3M MOCVD product range - with the ability to deposit highly conformal metal films at low temperatures required for bonded substrate processing.