AVP / RVP

Delivers superior process results

The AVP/RVP vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation and LPCVD applications.

Superior process results

  • Thermal control from 100 to >1200°C
  • Advanced injector technology for optimal gas distribution
  • Low O2 load lock maintains controlled wafer environment and ensures repeatability

Low cost of ownership

  • Single or dual-boat configuration
  • Dual-boat configuration eliminates wafer load/unload time
  • In-situ clean capability reduces CoO by up to 50%
  • Fast temperature ramp/cool option enables up to 30% reduction in process time

System flexibility

  • Run 150 and 200 mm simultaneously with no hardware changes
  • Compatible with perforated, bonded and ultra-thin substrates
  • Field conversion kits enable fast applications changes

Inquiry about: AVP / RVP

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