Primaxx® HF Vapor Release Etch

Dry HF vapor etch processing for removing sacrificial oxide layers 

SPTS offers the broadest range of dry HF vapor release products, from lab systems for research and development to multi-chambered cluster tools for high volume production. The industry leading Primaxx® HF vapor etch release technology is used to remove sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.

Our proprietary dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology.

Combining anhydrous HF vapor and alcohol vapor at reduced pressure and elevated temperature provides a wide, stable process window that can address different oxide compositions and thicknesses, while maintaining high selectivity to other common materials found in MEMS designs including exposed aluminum/alloy features such as mirrors and bondpads.

Primaxx® Monarch300

Primaxx® Monarch300

The Primaxx® Monarch300 is a fully...

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Primaxx® Monarch 25

Primaxx® Monarch 25

The Monarch25 25-wafer batch process module is designed for...

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Primaxx® Monarch 3

Primaxx® Monarch 3

This compact module includes a three-wafer process chamber, and...

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Primaxx® uEtch

Primaxx® uEtch

Fully integrated,...

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