Single Wafer Platforms

To address the requirements of both volume manufacturing, pilot production and R&D applications, SPTS offers their etch and deposition process technologies on a range of wafer-handling platform options:

fxP - an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

c2L - a smaller production system for 3 – 8” wafers, supporting up to 3 process modules for flexibility and control. 

LPX - combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.

fxP Platform

fxP Platform

The fxP is an 8-sided cluster system supporting...

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c2L Platform

c2L Platform

The c2L is an smaller production system for 3...

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LPX Platform

LPX Platform

The LPX platform combines a manually-loaded, single...

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