Sigma® Deposition Systems

Covering conventional PVD through to MOCVD

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD

Metal Deposition Technologies

  • Standard PVD – conventional sputter modules for low topography features
  • Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features
  • C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

Advantages of SPTS PVD

  • Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.
  • Planar target with full face erosion
    • avoids re-sputtering, reduces particle contamination
    • improves target life
  • Rapid target change (<5mins), with common magnetron increases uptime
  • Reliable handling of fragile, thinned or bowed wafers
  • "Super Uniformity" option available for specialist applications
  • Multi-wafer degas to increase throughput for long (low temp) degas applications
  • Common software for 200mm and 300mm systems - ease of use

Markets Served by PVD

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