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Discusses the introduction of blanket silicon etching to replace CMP, as part of a joint development project with imec to optimize a manufacturable "TSV-last" route for a multi-wafer stack.
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Describes how SPTS worked with Skyworks to significantly improve Mean Time Before Clean (MTBC) for a SiN etch step, used in the manufacturing of their GaAs RF devices.
Describes how SPTS worked with Qorvo to enable them to successfully install and qualify multiple tools to satisfy the need for a rapid ramp in production.