Application Briefs


Plasma Processes for VCSELs

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Additive Printing Solution Dams

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Inkjet - Package Marking

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SiC Etch for Power & RF Devices

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WL Packaging of MEMS

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XeF2 for MEMS Release

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Via Reveal Processing

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Plasma Etch End-point Control

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Plasma Dicing

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MVD for MEMS

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MEMS Microphones

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Low Temp CVD for MEMS

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Intro to HF Release Etch

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High Productivity UBM-RDL

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FOWLP - PVD Processes

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Blanket Silicon Etch

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AlN PVD for RF-IC & MEMS

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SPT Microtechnologies (Thermal Products) Application Briefs


Thick Poly-Si for MEMS

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LPCVD SiN for MEMS

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H2 Annealing for MEMS

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Case Studies


University of Swansea - "Plasma Etch for Silicon Microneedles"

Illustrates the results of a joint development project between SPTS and University of Swansea to create a process for volume production of silicon microneedles for biomedical applications.

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imec - "Blanket Silicon Etch for Lower Cost TSV"

Discusses the introduction of blanket silicon etching to replace CMP, as part of a joint development project with imec to optimize a manufacturable "TSV-last" route for a multi-wafer stack.

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Skyworks - "Improving MTBC for SiN Etch"

Describes how SPTS worked with Skyworks to significantly improve Mean Time Before Clean (MTBC) for a SiN etch step, used in the manufacturing of their GaAs RF devices.

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Qorvo - "Successful Partnering for a Rapid Ramp"

Describes how SPTS worked with Qorvo to enable them to successfully install and qualify multiple tools to satisfy the need for a rapid ramp in production.

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