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  • 公司概述
    • 關於我們
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    • 管理階層
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      • 事業群管理層
    • 公司相关企业
      • 奥宝科技子公司
      • 奥宝科技合资公司
  • PCB
    • SOLUTIONS & TECHNOLOGIES
      • 直接成像
        • IC 基板
        • 高階 HDI、高階柔性板
        • HDI、柔性板、高階 MLB
        • MLB
        • QTA
        • 防焊
        • DI for Touch
      • 自動光學檢測 (AOI)
        • IC 基板 (低至 5 微米)
        • PCB (低至 25 微米)
        • 二維測量
        • AOI for Touch Sensors
      • 自動光學成形
      • 噴印 / 積層列印
      • UV鐳射鑽孔系統
      • 雷射繪圖
      • 奧寶科技智慧工廠
      • CAM 與工程
        • CAM
        • 工程
  • FPD
    • SOLUTIONS & TECHNOLOGIES
      • 自動光學檢測 (AOI)
      • 加值型應用
      • 電性測試
      • 修復解決方案
      • Process Information & Classification
  • Semiconductor Devices - SPTS
    • SOLUTIONS & TECHNOLOGIES
      • Plasma Etch
      • Plasma Dicing
      • HF 釋放式蝕刻
      • XeF2 Vapor Release Etch
      • 金屬沈積
      • Molecular Vapor Deposition (MVD®)
      • PECVD
      • Thermal Products
        • Vertical Batch Furnaces
        • APCVD
      • Additive Printing Solutions
      • 單晶圓平台
    • Applications
      • 先進封裝
      • Micro Electro Mechanical Systems (MEMS)
      • 功率設備
      • RF-IC
      • LED 製造
      • 半導體
    • About SPTS
      • About SPTS
      • Corporate Responsibility
      • Awards
      • SPTS Careers
      • SPTS Contacts
      • Resource Library
        • Tech Insights
          • MEMS
            • 1000th DRIE module installed
            • AlN and its Uses in the Electronics Industry (Part I)
            • Claritas End-point for DRIE
            • Cost-Effective Low Stress SiN for MEMS
            • Etch and Deposition Processes for BioMEMS Manufacturing
            • Introduction to HF Vapor Etch
            • Low Temperature PECVD for MEMS
            • MEMS for Mobile Applications
            • MEMS Microphones
            • Morflex – Flexible Process Control for MEMS & TSV
            • MVD Anti-stiction Coating for MEMS
            • Plasma Dicing (Dice Before Grind)
            • Plasma Dicing (Dice After Grind)
            • Plasma Etch End-Point Control
            • Plasma Processes for VCSELs
            • Surface Smoothing Processes for High Performance AlN Piezoelectrics
            • Wafer Level Packaging of MEMS
            • Xenon Difluoride - Dry Vapor Etch for Releasing MEMS
          • Advanced Packaging
            • Fan-out Wafer Level Packaging
            • Blanket Silicon Etching
            • High Productivity PVD for UBM/RDL
            • Inkjet Printing for Package Marking
            • Inkjet Printing for Underfill Dam
            • Via Reveal Passivation
            • Via Reveal Processing
            • Morflex - Flexible Process Control for MEMS and TSV Etch
          • Power Device Manufacturing
            • SiC Etch for Power & RF Devices
            • 300mm PVD for Power Devices
          • RF-IC
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