Flexible printed circuits (FPCs) are making a profound impact on electronic design, ushering in smaller, lighter, and increasingly functional devices that would otherwise be difficult, if not impossible, to build. Now, the market demand for highly innovative circuits has roll-to-roll (R2R) manufacturing emerging as a truly effective means for printing FPCs in high volumes, with minimum handling damage, with high yield, and at high speeds.
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by manufacturing processes that have evolved from manual assembly to highly automated production. As manufacturing technology further develops, processes become more complex and more sophisticated, including the ability to inspect and then shape defects that would once have resulted in scrapped panels. A significant opportunity is now emerging for the PCB manufacturing industry to capitalize on artificial intelligence (AI) and optimize production processes and, ultimately, the entire PCB manufacturing facility. Read more from Meny Gantz, VP of Marketing in Orbotech’s Printed Circuit Board (PCB) division.
The shift from combustion engine-based cars with human drivers to semi-autonomous/ autonomous electronics-based cars presents clear design challenges. With automotive electronics projected to account for 35% of the total cost of the car by 2020, and 50% of the total cost by 2030, the physical footprint of the electronics will need to be significantly reduced in order to ensure the high functionality. Find out more about the central role that HDI can play in shrinking electronics.
The introduction of 5G communications will advance capacity and connectivity far beyond current levels and is expected to drive new advances in smart appliances and smart home technology- read more here.
At the recent CPCA Show in Shanghai, Orbotech celebrated having over 100 of their Orbotech Diamond™ direct imaging (DI) machines in the marketplace. Barry Matties caught up with Meny Gantz—VP of marketing for Orbotech’s PCB division—to talk about the drivers behind the success of Orbotech Diamond systems before turning the conversation toward the future and Industry 4.0. Orbotech’s large footprint comes with a massive amount of data collection as they now widen their focus to smart factory solutions and managing data to support their customers’ increasing demands.
Peter Alliston, VP sales for Orbotech West, discussed the trends currently driving PCB technology, and described how leading suppliers of imaging and inspection tools had responded with developments in the capability of their equipment. He identified four market sectors: Internet of Things and 5G infrastructure, smartphones, automotive, and Industry 4.0 and robotics.
To effectively address the question of how manufacturers can prepare for the 5G wireless networking juggernaut, one can look ahead to the impact 5G will have on electronic end devices targeted to support 10X faster data rates and 1000X more data traffic. 5G will facilitate powerful connectivity throughout all industries, and manufacturing innovation must advance to support the scale and quality necessary for reliable implementation. The impact of 5G on PCB production provides a good specific illustration of the changes needed.
To read more from Orbotech expert Benny Solomon on how manufacturers are preparing for 5G, click below.
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI. Lior also offered his advice to board shops trying to survive in today’s market and how to deal with a new breed of customers.
Each New Year invites a host of achievements, inventions, and technological advancements. As we enter the early months of another year, industry experts share their opinions on what's ahead for tech and engineering in 2018. Below you can read Orbotech's predictions by Tally Kaplan Porat, Director of Corporate Marketing.
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