Suzhou, China – C-TEX Show– May 14, 2014 – Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, is presenting its latest innovations for advanced manufacturing in Hall 4A #AZ21.

“Being the vendor of choice for electronic components suppliers in Asia Pacific requires not only continuing our proven track record of delivering best-in-class technology solutions that fit our customers’ current requirements, but also providing the capabilities and support needed to ensure they can progress on the technology path of tomorrow”, said Mr. Gaby Waisman, President of Orbotech Pacific Ltd. “At this year’s exhibition, we are pleased to show several of our systems that have an expanded performance range to address the fast-changing designs of today’s most sophisticated electronic devices.”

For the first time in Northern China, Orbotech is presenting the new Ultra Fusion™ 600 automated optical inspection (AOI) system for leading-edge IC substrates and advanced HDI down to 5μm. Also being demonstrated is Discovery™ II, the newest generation of the world’s best-selling Discovery™ automated optical inspection (AOI) series. Available in several models, Discovery™ II ensures high detection with greater operational efficiency for production down to 30μm. The Sprint™ 120 inkjet printer with DotStream Technology™ delivers high speed and top quality printing for consistent, volume production and yield improvement at lower running costs, now with Taiyo flex ink. The PerFix™ 200 automated optical rework (AOR) system is designed to achieve fast, perfect rework of shorts and excess copper on the most advanced PCBs, including flex, HDI, IC substrates and complex high layer count applications. InSight PCB® pre-CAM software and other CAM/Engineering developments by Frontline PCB Solutions will also be on display.

About Orbotech Ltd.

Orbotech Ltd.(NASDAQ/GSM:ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components. Today, virtually every electronic device is produced usingOrbotechtechnology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered inIsraeland operating from multiple locations internationally, Orbotech’s highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company’s end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company’s filings with theSEC at www.sec.gov and visit the Company’s corporate website at www.orbotech.com  The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.

Company Contact:

Michelle Harnish

Marketing Communications Project Manager

Orbotech Ltd.

U.S. Tel: +1-603-289-7937

michelle.harnish@orbotech.com

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Except for historical information, the matters discussed in this website (including in press releases, webcasts, presentations, posts and other places) are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events as of the date of the applicable information (press releases, webcasts, presentations, or posts) and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. This information is also supplemented by the information in the applicable document on this website (e.g., press release, webcast, presentation,  posts and other document). The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this website (including press releases, webcasts, presentations,  posts and other places) to reflect new information, future events or otherwise, except as required by law.