YAVNE, ISRAEL | ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has been named by imec, a world-leading nano-electronics research center, as a new supplier of physical vapor deposition (PVD) solutions for under bump metallization (UBM) and redistribution layer (RDL) processes for next generation fan-out packaging technologies. Imec has selected SPTS’s Sigma® fxP PVD solution as the new process tool of record (PTOR) for low temperature PVD for development of novel fan-out technologies such as flexible micro-bumps for chip scale packaging.
 
“To meet the technical requirements of future micro- and nano-electronics, novel 3D integrated circuit (IC) architectures need to be developed to meet scaling challenges without compromising cost, performance, and power budgets,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. ”Imec works closely with leading semiconductor companies to develop innovative wafer-level packaging architectures that will meet the performance requirements of next generation devices such as application processors that drive virtual reality applications or enable high performance computing for artificial intelligence. We are proud that imec selected SPTS’ Sigma® for its 3D System Integration Program, reflecting our PVD solutions’ excellent results, particularly in low temperature RDL and copper pillar creation on low temperature tolerant polymers.  We look forward to working with imec and its partners in developing innovative interconnect and fan-out technologies.”
 
Mr Crofton added,” SPTS specializes in UBM/RDL PVD for Flip Chip and fan-out applications, and our low temperature PVD capabilities will support the development of a range of new interconnect technologies at imec, including flexi bumps, to address the scaling and packaging needs of future generations of nano-electronics.”
 
Dr Anthony Barker, PVD Product Manager at SPTS, will be giving an invited talk titled: “Fantastic Fan-out; Improving Interconnect Productivity for the Fastest Growing Packaging Platform” on Thursday 13 July, 14.00 – 14.30 at the Advanced Packaging Meet the Expert Session, at SEMICON West, in San Francisco.
 
To learn more about SPTS’s Sigma fxP PVD solutions, and full range of industry leading etch, deposition, and inkjet solutions for advanced packaging applications visit SPTS Technologies on Booth No.7617 in West Hall at SEMICON West, 11 – 13 July, Moscone Center, San Francisco.
 
About Sigma® fxP PVD
 
The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices.  In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP.  For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound.  Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.
 
 
About Orbotech Ltd.
 
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit http://www.orbotech.com and www.spts.com
 
 
 
ORBOTECH COMPANY CONTACTS:
 
Rami Rozen
Director of Investor Relations
Tel: +972-8-942-3582
 
Tally Kaplan Porat
Director of Corporate Marketing
Tel: +972-8-942-3603
 
 

Cautionary Statement Regarding Forward-Looking Statements 

Some of the matters discussed in this website (including in press releases, webcasts, presentations, posts and other places) are projections or other forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this website to identify forward-looking statements. These statements are only predictions and actual events or results may differ materially. We refer you to the documents KLA files from time to time with the Securities and Exchange Commission, specifically, KLA’s most recent Form 10-K and Form 10-Q.  These documents contain important factors that could cause the actual results to differ materially from those contained in projections and other forward-looking statements including, among others, volatility and cyclicality in the semiconductor equipment industry and other industries in which KLA and its subsidiaries operate, potential fluctuations in operating results and stock price, international trade and economic conditions, the ability to compete successfully worldwide, management of technological change and customer requirements, fluctuations in product mix within and among divisions, the timing and strength of product and service offerings by KLA and its subsidiaries and its and their competitors, intellectual property obsolescence and infringement, and factors associated with key employees, key suppliers, acquisitions, and litigation. Additional factors impacting the business of KLA and its subsidiaries include integration between KLA and its acquired companies, ability to achieve synergies and other benefits of acquisitions in the timeframe anticipated, if at all,

KLA and its subsidiaries assume no obligation to update the information in this website (including press releases, webcasts, presentations, posts and other places) to reflect new information, future events or otherwise, except as required by law.

Disclaimer

This site is provided by KLA Corporation (or its subsidiaries) on an "as is" basis. None of KLA and its subsidiaries make any representations or warranties of any kind, express or implied, as to the operation of the site, or the accuracy or completeness of the information, content, materials, pricing, services, or products included on this site. Product specifications and prices are subject to change without notice, and products may be discontinued without notice. None of KLA and its subsidiaries will be liable for any damages of any kind arising from the use of this site, or the material that is provided on this site, including but not limited to direct, indirect, special, incidental, punitive, or consequential damages.