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Orbotech的UV鐳射鑽孔系統爲挑戰IC載板和柔板提供了壹個新的性能水平。 利用創新技術，Orbotech的UV鐳射鑽孔系統達到了更高的速度和精度，使能以最高效率、最節省成本的方式在最複雜的設計上獲得最優質的鑽孔。
利用非凡的多通路技術TM，Orbotech的紫外線激光鑽孔系統達到了3500孔/秒以上的高鑽孔速度，而對精度毫無影響。 支持通孔和盲孔的鑽孔作業，我們的UV鐳射鑽孔系統能鑽30um以下的銅、環氧樹脂、焊料掩膜和聚酰亞胺等微孔。 憑借內置的測量工具，系統進行自動光學實驗和計量，確保壹致的、頂級性能的鑽孔。
Emerald™ 150 UV 鐳射鑽孔系統
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